Design and analysis of micro-channel heat-exchanger embedded in Low Temperature Co-fire Ceramic (LTCC)

Increased device density, switching speeds of integrated circuits and decrease in package size is placing new demands for high power thermal-management. The convectional method of forced air cooling with passive heat sink can handle heat fluxes up-to 3-5W/cm2; however current microprocessors are operating at levels of 100W/cm2, This demands the usage of novel thermal-management systems. In this work, water-cooling systems with active heat sink are embedded in the substrate. The research involved fabricating LTCC substrates of various configurations - an open-duct substrate, the second with thermal vias and the third with thermal vias and free-standing metal columns and metal foil. Thermal testing was performed experimentally and these results are compared with CFD results. An overall thermal resistance for the base substrate is demonstrated to be 3.4oC/W-cm2. Addition of thermal vias reduces the effective resistance of the system by 7times and further addition of free standing columns reduced it by 20times.

Modeling of a Heat-Induced Buckling of Plates Using the Mesh-free Method

In the process of engineering design of structural shapes, the flat plate analysis results can be generalized to predict behaviors of complete structural shapes. In this case, the purpose of this project is to analyze a thin flat plate under conductive heat transfer and to simulate the temperature distribution, thermal stresses, total displacements, and buckling deformations. The current approach in these cases has been using the Finite Element Method (FEM), whose basis is the construction of a conforming mesh. In contrast, this project uses the mesh-free Scan Solve Method. This method eliminates the meshing limitation using a non-conforming mesh. I implemented this modeling process developing numerical algorithms and software tools to model thermally induced buckling. In addition, convergence analysis was achieved, and the results were compared with FEM. In conclusion, the results demonstrate that the method gives similar solutions to FEM in quality, but it is computationally less time consuming.