2 resultados para Environmental Stresses

em Digital Commons at Florida International University


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Red pigments, products of different metabolic pathways, occur in terrestrial plants. The flavonoid pathway contributes the greatest diversity, culminating in the prevalence of anthocyanins in the angiosperms. Anthocyanins are produced in flowers and fruits, and also in vegetative organs, but have been poorly researched in the latter. Anthocyanins are commonly produced in: 1. rapidly expanding leaves of tropical plants; 2. senescing leaves of temperate plants; 3. undersurfaces of floating leaves of aquatic plants; 4. abaxial surfaces of leaves of understory plants; and 5. leaves subjected to various environmental stresses. The distribution of anthocyanins in leaves, both in presence and in tissue distribution, is influenced by both phylogeny and development. Few species produce anthocyanins in leaf tissues derived from both dermal and ground embryonic tissue. These influences will be important in resolving the ecological roles of anthocyanins in leaves.

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Microelectronic systems are multi-material, multi-layer structures, fabricated and exposed to environmental stresses over a wide range of temperatures. Thermal and residual stresses created by thermal mismatches in films and interconnections are a major cause of failure in microelectronic devices. Due to new device materials, increasing die size and the introduction of new materials for enhanced thermal management, differences in thermal expansions of various packaging materials have become exceedingly important and can no longer be neglected. X-ray diffraction is an analytical method using a monochromatic characteristic X-ray beam to characterize the crystal structure of various materials, by measuring the distances between planes in atomic crystalline lattice structures. As a material is strained, this interplanar spacing is correspondingly altered, and this microscopic strain is used to determine the macroscopic strain. This thesis investigates and describes the theory and implementation of X-ray diffraction in the measurement of residual thermal strains. The design of a computer controlled stress attachment stage fully compatible with an Anton Paar heat stage will be detailed. The stress determined by the diffraction method will be compared with bimetallic strip theory and finite element models.