8 resultados para Embedded systems

em Digital Commons at Florida International University


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For the past several decades, we have experienced the tremendous growth, in both scale and scope, of real-time embedded systems, thanks largely to the advances in IC technology. However, the traditional approach to get performance boost by increasing CPU frequency has been a way of past. Researchers from both industry and academia are turning their focus to multi-core architectures for continuous improvement of computing performance. In our research, we seek to develop efficient scheduling algorithms and analysis methods in the design of real-time embedded systems on multi-core platforms. Real-time systems are the ones with the response time as critical as the logical correctness of computational results. In addition, a variety of stringent constraints such as power/energy consumption, peak temperature and reliability are also imposed to these systems. Therefore, real-time scheduling plays a critical role in design of such computing systems at the system level. We started our research by addressing timing constraints for real-time applications on multi-core platforms, and developed both partitioned and semi-partitioned scheduling algorithms to schedule fixed priority, periodic, and hard real-time tasks on multi-core platforms. Then we extended our research by taking temperature constraints into consideration. We developed a closed-form solution to capture temperature dynamics for a given periodic voltage schedule on multi-core platforms, and also developed three methods to check the feasibility of a periodic real-time schedule under peak temperature constraint. We further extended our research by incorporating the power/energy constraint with thermal awareness into our research problem. We investigated the energy estimation problem on multi-core platforms, and developed a computation efficient method to calculate the energy consumption for a given voltage schedule on a multi-core platform. In this dissertation, we present our research in details and demonstrate the effectiveness and efficiency of our approaches with extensive experimental results.

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Catering to society’s demand for high performance computing, billions of transistors are now integrated on IC chips to deliver unprecedented performances. With increasing transistor density, the power consumption/density is growing exponentially. The increasing power consumption directly translates to the high chip temperature, which not only raises the packaging/cooling costs, but also degrades the performance/reliability and life span of the computing systems. Moreover, high chip temperature also greatly increases the leakage power consumption, which is becoming more and more significant with the continuous scaling of the transistor size. As the semiconductor industry continues to evolve, power and thermal challenges have become the most critical challenges in the design of new generations of computing systems. In this dissertation, we addressed the power/thermal issues from the system-level perspective. Specifically, we sought to employ real-time scheduling methods to optimize the power/thermal efficiency of the real-time computing systems, with leakage/ temperature dependency taken into consideration. In our research, we first explored the fundamental principles on how to employ dynamic voltage scaling (DVS) techniques to reduce the peak operating temperature when running a real-time application on a single core platform. We further proposed a novel real-time scheduling method, “M-Oscillations” to reduce the peak temperature when scheduling a hard real-time periodic task set. We also developed three checking methods to guarantee the feasibility of a periodic real-time schedule under peak temperature constraint. We further extended our research from single core platform to multi-core platform. We investigated the energy estimation problem on the multi-core platforms and developed a light weight and accurate method to calculate the energy consumption for a given voltage schedule on a multi-core platform. Finally, we concluded the dissertation with elaborated discussions of future extensions of our research.

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A novel and new thermal management technology for advanced ceramic microelectronic packages has been developed incorporating miniature heat pipes embedded in the ceramic substrate. The heat pipes use an axially grooved wick structure and water as the working fluid. Prototype substrate/heat pipe systems were fabricated using high temperature co-fired ceramic (alumina). The heat pipes were nominally 81 mm in length, 10 mm in width, and 4 mm in height, and were charged with approximately 50–80 μL of water. Platinum thick film heaters were fabricated on the surface of the substrate to simulate heat dissipating electronic components. Several thermocouples were affixed to the substrate to monitor temperature. One end of the substrate was affixed to a heat sink maintained at constant temperature. The prototypes were tested and shown to successful and reliably operate with thermal loads over 20 Watts, with thermal input from single and multiple sources along the surface of the substrate. Temperature distributions are discussed for the various configurations and the effective thermal resistance of the substrate/heat pipe system is calculated. Finite element analysis was used to support the experimental findings and better understand the sources of the system's thermal resistance. ^

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The tragic events of September 11th ushered a new era of unprecedented challenges. Our nation has to be protected from the alarming threats of adversaries. These threats exploit the nation's critical infrastructures affecting all sectors of the economy. There is the need for pervasive monitoring and decentralized control of the nation's critical infrastructures. The communications needs of monitoring and control of critical infrastructures was traditionally catered for by wired communication systems. These technologies ensured high reliability and bandwidth but are however very expensive, inflexible and do not support mobility and pervasive monitoring. The communication protocols are Ethernet-based that used contention access protocols which results in high unsuccessful transmission and delay. An emerging class of wireless networks, named embedded wireless sensor and actuator networks has potential benefits for real-time monitoring and control of critical infrastructures. The use of embedded wireless networks for monitoring and control of critical infrastructures requires secure, reliable and timely exchange of information among controllers, distributed sensors and actuators. The exchange of information is over shared wireless media. However, wireless media is highly unpredictable due to path loss, shadow fading and ambient noise. Monitoring and control applications have stringent requirements on reliability, delay and security. The primary issue addressed in this dissertation is the impact of wireless media in harsh industrial environment on the reliable and timely delivery of critical data. In the first part of the dissertation, a combined networking and information theoretic approach was adopted to determine the transmit power required to maintain a minimum wireless channel capacity for reliable data transmission. The second part described a channel-aware scheduling scheme that ensured efficient utilization of the wireless link and guaranteed delay. Various analytical evaluations and simulations are used to evaluate and validate the feasibility of the methodologies and demonstrate that the protocols achieved reliable and real-time data delivery in wireless industrial networks.

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Various nondestructive testing (NDT) technologies for construction and performance monitoring have been studied for decades. Recently, the rapid evolution of wireless sensor network (WSN) technologies has enabled the development of sensors that can be embedded in concrete to monitor the structural health of infrastructure. Such sensors can be buried inside concrete and they can collect and report valuable volumetric data related to the health of a structure during and/or after construction. Wireless embedded sensors monitoring system is also a promising solution for decreasing the high installation and maintenance cost of the conventional wire based monitoring systems. Wireless monitoring sensors need to operate for long time. However, sensor batteries have finite life-time. Therefore, in order to enable long operational life of wireless sensors, novel wireless powering methods, which can charge the sensors’ rechargeable batteries wirelessly, need to be developed. The optimization of RF wireless powering of sensors embedded in concrete is studied here. First, our analytical results focus on calculating the transmission loss and propagation loss of electromagnetic waves penetrating into plain concrete at different humidity conditions for various frequencies. This analysis specifically leads to the identification of an optimum frequency range within 20–80 MHz that is validated through full-wave electromagnetic simulations. Second, the effects of various reinforced bar configurations on the efficiency of wireless powering are investigated. Specifically, effects of the following factors are studied: rebar types, rebar period, rebar radius, depth inside concrete, and offset placement. This analysis leads to the identification of the 902–928 MHz ISM band as the optimum power transmission frequency range for sensors embedded in reinforced concrete, since antennas working in this band are less sensitive to the effects of varying humidity as well as rebar configurations. Finally, optimized rectennas are designed for receiving and/or harvesting power in order to charge the rechargeable batteries of the embedded sensors. Such optimized wireless powering systems exhibit significantly larger efficiencies than the efficiencies of conventional RF wireless powering systems for sensors embedded in plain or reinforced concrete.

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High efficiency of power converters placed between renewable energy sources and the utility grid is required to maximize the utilization of these sources. Power quality is another aspect that requires large passive elements (inductors, capacitors) to be placed between these sources and the grid. The main objective is to develop higher-level high frequency-based power converter system (HFPCS) that optimizes the use of hybrid renewable power injected into the power grid. The HFPCS provides high efficiency, reduced size of passive components, higher levels of power density realization, lower harmonic distortion, higher reliability, and lower cost. The dynamic modeling for each part in this system is developed, simulated and tested. The steady-state performance of the grid-connected hybrid power system with battery storage is analyzed. Various types of simulations were performed and a number of algorithms were developed and tested to verify the effectiveness of the power conversion topologies. A modified hysteresis-control strategy for the rectifier and the battery charging/discharging system was developed and implemented. A voltage oriented control (VOC) scheme was developed to control the energy injected into the grid. The developed HFPCS was compared experimentally with other currently available power converters. The developed HFPCS was employed inside a microgrid system infrastructure, connecting it to the power grid to verify its power transfer capabilities and grid connectivity. Grid connectivity tests verified these power transfer capabilities of the developed converter in addition to its ability of serving the load in a shared manner. In order to investigate the performance of the developed system, an experimental setup for the HF-based hybrid generation system was constructed. We designed a board containing a digital signal processor chip on which the developed control system was embedded. The board was fabricated and experimentally tested. The system's high precision requirements were verified. Each component of the system was built and tested separately, and then the whole system was connected and tested. The simulation and experimental results confirm the effectiveness of the developed converter system for grid-connected hybrid renewable energy systems as well as for hybrid electric vehicles and other industrial applications.

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A novel and new thermal management technology for advanced ceramic microelectronic packages has been developed incorporating miniature heat pipes embedded in the ceramic substrate. The heat pipes use an axially grooved wick structure and water as the working fluid. Prototype substrate/heat pipe systems were fabricated using high temperature co-fired ceramic (alumina). The heat pipes were nominally 81 mm in length, 10 mm in width, and 4 mm in height, and were charged with approximately 50-80 mL of water. Platinum thick film heaters were fabricated on the surface of the substrate to simulate heat dissipating electronic components. Several thermocouples were affixed to the substrate to monitor temperature. One end of the substrate was affixed to a heat sink maintained at constant temperature. The prototypes were tested and shown to successful and reliably operate with thermal loads over 20 Watts, with thermal input from single and multiple sources along the surface of the substrate. Temperature distributions are discussed for the various configurations and the effective thermal resistance of the substrate/heat pipe system is calculated. Finite element analysis was used to support the experimental findings and better understand the sources of the system's thermal resistance.

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Increased device density, switching speeds of integrated circuits and decrease in package size is placing new demands for high power thermal-management. The convectional method of forced air cooling with passive heat sink can handle heat fluxes up-to 3-5W/cm2; however current microprocessors are operating at levels of 100W/cm2, This demands the usage of novel thermal-management systems. In this work, water-cooling systems with active heat sink are embedded in the substrate. The research involved fabricating LTCC substrates of various configurations - an open-duct substrate, the second with thermal vias and the third with thermal vias and free-standing metal columns and metal foil. Thermal testing was performed experimentally and these results are compared with CFD results. An overall thermal resistance for the base substrate is demonstrated to be 3.4oC/W-cm2. Addition of thermal vias reduces the effective resistance of the system by 7times and further addition of free standing columns reduced it by 20times.