Nanostructured Cu/Nb multilayers subjected to helium ion-irradiation

Helium ion-irradiation experiments have been performed in single layer Cu films, Nb films and Cu/Nb multilayer films with layer thickness varying from 2.5 nm to 100 nm each layer. Peak helium concentration approaches a few atomic percent with 6-9 displacement-per-atom in Cu and Nb. He bubbles were observed in single layer Cu and Nb films, as well as in Cu 100 nm/Nb 100 nm multilayers with helium bubbles aligned along layer interfaces. Helium bubbles are not resolved via transmission electron microscopy in Cu 2.5 nm/Nb 2.5 nm multilayers. These studies indicate that layer interface may play an important role in annihilating ion-irradiation induced defects such as vacancies and interstitials and have implications in improving the radiation tolerance of metallic materials using nanostructured multilayers. © 2007 Elsevier B.V. All rights reserved.

Porous tin film synthesized by electrodeposition and the electrochemical performance for lithium-ion batteries

Porous tin films as anode for lithium-ion batteries are electrodeposited on graphite paper. Homogeneous tin films with significant void space accommodate the volume change during tin lithiation/delithiation. Through adjusting the electrodeposition currents and time, the morphologies and void space of tin films on graphite paper are controllable. At fixed electrodeposition current densities, the prolonged electrodeposition time plays the role in growing big tin particles and resulting the disappearance of void space among tin particles. The increased electrodeposition current plays the role to increase the quantity of tin seeds in thickness of tin film, and the void space among tin particles remains but the thick film limits its electrochemical performance. The tin films electrodeposited at an optimized current densities and for an optimized electrodeposition time, present the best electrochemical performance, because the tin nanoparticles are well dispersed on graphite substrate including void space. The tin film electrodeposited at 0.2 A cm-2 for 2 min shows the capacity of 1.0 mAh cm-2 after 50 charge/discharge cycles. The void space of tin film is very important for the best capacity and cyclic ability. The metallic tin film produced at 0.4 A cm-2 for 3 min remains the uniform and microporous structure after charge/discharge for 50 cycles.

Stabilization of catalyst particles against sintering on oxide supports with high oxygen ion lability exemplified by Ir-catalyzed decomposition of N2O

Iridium nanoparticles deposited on a variety of surfaces exhibited thermal sintering characteristics that were very strongly correlated with the lability of lattice oxygen in the supporting oxide materials. Specifically, the higher the lability of oxygen ions in the support, the greater the resistance of the nanoparticles to sintering in an oxidative environment. Thus with γ-Al2O3 as the support, rapid and extensive sintering occurred. In striking contrast, when supported on gadolinia-ceria and alumina-ceria-zirconia composite, the Ir nanoparticles underwent negligible sintering. In keeping with this trend, the behavior found with yttria-stabilized zirconia was an intermediate between the two extremes. This resistance, or lack of resistance, to sintering is considered in terms of oxygen spillover from support to nanoparticles and discussed with respect to the alternative mechanisms of Ostwald ripening versus nanoparticle diffusion. Activity towards the decomposition of N2O, a reaction that displays pronounced sensitivity to catalyst particle size (large particles more active than small particles), was used to confirm that catalytic behavior was consistent with the independently measured sintering characteristics. It was found that the nanoparticle active phase was Ir oxide, which is metallic, possibly present as a capping layer. Moreover, observed turnover frequencies indicated that catalyst-support interactions were important in the cases of the sinter-resistant systems, an effect that may itself be linked to the phenomena that gave rise to materials with a strong resistance to nanoparticle sintering.