Strain-facilitated process for the lift-off of a Si layer of less than 20 nm thickness

We report a process for the lift-off of an ultrathin Si layer. By plasma hydrogenation of a molecular-beam-epitaxy-grown heterostructure of SiSb-doped-SiSi, ultrashallow cracking is controlled to occur at the depth of the Sb-doped layer. Prior to hydrogenation, an oxygen plasma treatment is used to induce the formation of a thin oxide layer on the surface of the heterostructure. Chemical etching of the surface oxide layer after hydrogenation further thins the thickness of the separated Si layer to be only 15 nm. Mechanisms of hydrogen trapping and strain-facilitated cracking are discussed. © 2005 American Institute of Physics.

Modelling of transient heat transfer in annealing furnaces

This is a study of heat transfer in a lift-off furnace which is employed in the batch annealing of a stack of coils of steel strip. The objective of the project is to investigate the various factors which govern the furnace design and the heat transfer resistances, so as to reduce the time of the annealing cycle, and hence minimize the operating costs. The work involved mathematical modelling of patterns of gas flow and modes of heat transfer. These models are: Heat conduction and its conjectures in the steel coils;Convective heat transfer in the plates separating the coils in the stack and in other parts of the furnace; and Radiative and convective heat transfer in the furnace by using the long furnace model. An important part of the project is the development of numerical methods and computations to solve the transient models. A limited number of temperature measurements was available from experiments on a test coil in an industrial furnace. The mathematical model agreed well with these data. The model has been used to show the following characteristics of annealing furnaces, and to suggest further developments which would lead to significant savings: - The location of the limiting temperature in a coil is nearer to the hollow core than to the outer periphery. - Thermal expansion of the steel tends to open the coils, reduces their thermal conductivity in the radial direction, and hence prolongs the annealing cycle. Increasing the tension in the coils and/or heating from the core would overcome this heat transfer resistance. - The shape and dimensions of the convective channels in the plates have significant effect on heat convection in the stack. An optimal design of a channel is shown to be of a width-to-height ratio equal to 9. - Increasing the cooling rate, by using a fluidized bed instead of the normal shell and tube exchanger, would shorten the cooling time by about 15%, but increase the temperature differential in the stack. - For a specific charge weight, a stack of different-sized coils will have a shorter annealing cycle than one of equally-sized coils, provided that production constraints allow the stacking order to be optimal. - Recycle of hot flue gases to the firing zone of the furnace would produce a. decrease in the thermal efficiency up to 30% but decreases the heating time by about 26%.

State detection of bond wires in IGBT modules using eddy current pulsed thermography

Insulated gate bipolar transistor (IGBT) modules are important safety critical components in electrical power systems. Bond wire lift-off, a plastic deformation between wire bond and adjacent layers of a device caused by repeated power/thermal cycles, is the most common failure mechanism in IGBT modules. For the early detection and characterization of such failures, it is important to constantly detect or monitor the health state of IGBT modules, and the state of bond wires in particular. This paper introduces eddy current pulsed thermography (ECPT), a nondestructive evaluation technique, for the state detection and characterization of bond wire lift-off in IGBT modules. After the introduction of the experimental ECPT system, numerical simulation work is reported. The presented simulations are based on the 3-D electromagnetic-thermal coupling finite-element method and analyze transient temperature distribution within the bond wires. This paper illustrates the thermal patterns of bond wires using inductive heating with different wire statuses (lifted-off or well bonded) under two excitation conditions: nonuniform and uniform magnetic field excitations. Experimental results show that uniform excitation of healthy bonding wires, using a Helmholtz coil, provides the same eddy currents on each, while different eddy currents are seen on faulty wires. Both experimental and numerical results show that ECPT can be used for the detection and characterization of bond wires in power semiconductors through the analysis of the transient heating patterns of the wires. The main impact of this paper is that it is the first time electromagnetic induction thermography, so-called ECPT, has been employed on power/electronic devices. Because of its capability of contactless inspection of multiple wires in a single pass, and as such it opens a wide field of investigation in power/electronic devices for failure detection, performance characterization, and health monitoring.