Deformation microstructure under nanoindentations in Cu using 3D x-ray structural microscopy

We have used a recently developed x-ray structural microscopy technique to make nondestructive, submicron-resolution measurements of the deformation microstructure below a 100mN maximum load Berkovich nanoindent in single crystal Cu. Direct observations of plastic deformation under the indent were obtained using a ~0.5 µm polychromatic microbeam and diffracted beam depth profiling to make micron-resolution spatially-resolved x-ray Laue diffraction measurements. The local lattice rotations underneath the nanoindent were found to be heterogeneous in nature as revealed by geometrically necessary dislocation (GND) densities determined for positions along lines beneath a flat indent face and under the sharp Berkovich indent blade edges. Measurements of the local rotation-axes and misorientation-angles along these lines are discussed in terms of crystallographic slip systems.

A comparison of two distributed large-volume measurement systems:the mobile spatial co-ordinate measuring system and the indoor global positioning system

Advances in the area of industrial metrology have generated new technologies that are capable of measuring components with complex geometry and large dimensions. However, no standard or best-practice guides are available for the majority of such systems. Therefore, these new systems require appropriate testing and verification in order for the users to understand their full potential prior to their deployment in a real manufacturing environment. This is a crucial stage, especially when more than one system can be used for a specific measurement task. In this paper, two relatively new large-volume measurement systems, the mobile spatial co-ordinate measuring system (MScMS) and the indoor global positioning system (iGPS), are reviewed. These two systems utilize different technologies: the MScMS is based on ultrasound and radiofrequency signal transmission and the iGPS uses laser technology. Both systems have components with small dimensions that are distributed around the measuring area to form a network of sensors allowing rapid dimensional measurements to be performed in relation to large-size objects, with typical dimensions of several decametres. The portability, reconfigurability, and ease of installation make these systems attractive for many industries that manufacture large-scale products. In this paper, the major technical aspects of the two systems are briefly described and compared. Initial results of the tests performed to establish the repeatability and reproducibility of these systems are also presented. © IMechE 2009.

3D printed sensing patches with embedded polymer optical fibre Bragg gratings

The first demonstration of a polymer optical fibre Bragg grating (POFBG) embedded in a 3-D printed structure is reported. Its cyclic strain performance and temperature characteristics are examined and discussed. The sensing patch has a repeatable strain sensitivity of 0.38 pm/μepsilon. Its temperature behaviour is unstable, with temperature sensitivity values varying between 30-40 pm/°C.

Embedding silica and polymer fibre Bragg gratings (FBG) in plastic 3D-printed sensing patches

This paper reports the first demonstration of a silica fibre Bragg grating (SOFBG) embedded in an FDM 3-D printed housing to yield a dual grating temperature-compensated strain sensor. We also report the first ever integration of polymer fibre Bragg grating (POFBG) within a 3-D printed sensing patch for strain or temperature sensing. The cyclic strain performance and temperature characteristics of both devices are examined and discussed. The strain sensitivities of the sensing patches were 0.40 and 0.95 pm/μϵ for SOFBG embedded in ABS, 0.38 pm/μμ for POFBG in PLA, and 0.15 pm/μμ for POFBG in ABS. The strain response was linear above a threshold and repeatable. The temperature sensitivity of the SOFBG sensing patch was found to be up to 169 pm/°C, which was up to 17 times higher than for an unembedded silica grating. Unstable temperature response POFBG embedded in PLA was reported, with temperature sensitivity values varying between 30 and 40 pm/°C.