Development of room temperature operating single electron transistor using FIB etching and deposition technology

The single-electron transistor (SET) is one of the best candidates for future nano electronic circuits because of its ultralow power consumption, small size and unique functionality. SET devices operate on the principle of Coulomb blockade, which is more prominent at dimensions of a few nano meters. Typically, the SET device consists of two capacitively coupled ultra-small tunnel junctions with a nano island between them. In order to observe the Coulomb blockade effects in a SET device the charging energy of the device has to be greater that the thermal energy. This condition limits the operation of most of the existing SET devices to cryogenic temperatures. Room temperature operation of SET devices requires sub-10nm nano-islands due to the inverse dependence of charging energy on the radius of the conducting nano-island. Fabrication of sub-10nm structures using lithography processes is still a technological challenge. In the present investigation, Focused Ion Beam based etch and deposition technology is used to fabricate single electron transistors devices operating at room temperature. The SET device incorporates an array of tungsten nano-islands with an average diameter of 8nm. The fabricated devices are characterized at room temperature and clear Coulomb blockade and Coulomb oscillations are observed. An improvement in the resolution limitation of the FIB etching process is demonstrated by optimizing the thickness of the active layer. SET devices with structural and topological variation are developed to explore their impact on the behavior of the device. The threshold voltage of the device was minimized to ~500mV by minimizing the source-drain gap of the device to 17nm. Vertical source and drain terminals are fabricated to realize single-dot based SET device. A unique process flow is developed to fabricate Si dot based SET devices for better gate controllability in the device characteristic. The device vi parameters of the fabricated devices are extracted by using a conductance model. Finally, characteristic of these devices are validated with the simulated data from theoretical modeling.

IMPROVED SENSITIVITY OF RESONANT MASS SENSOR BASED ON MICRO TILTING PLATE AND MICRO CANTILEVER

Vapor sensors have been used for many years. Their applications range from detection of toxic gases and dangerous chemicals in industrial environments, the monitoring of landmines and other explosives, to the monitoring of atmospheric conditions. Microelectrical mechanical systems (MEMS) fabrication technologies provide a way to fabricate sensitive devices. One type of MEMS vapor sensors is based on mass changing detection and the sensors have a functional chemical coating for absorbing the chemical vapor of interest. The principle of the resonant mass sensor is that the resonant frequency will experience a large change due to a small mass of gas vapor change. This thesis is trying to build analytical micro-cantilever and micro-tilting plate models, which can make optimization more efficient. Several objectives need to be accomplished: (1) Build an analytical model of MEMS resonant mass sensor based on micro-tilting plate with the effects of air damping. (2) Perform design optimization of micro-tilting plate with a hole in the center. (3) Build an analytical model of MEMS resonant mass sensor based on micro-cantilever with the effects of air damping. (4) Perform design optimization of micro-cantilever by COMSOL. Analytical models of micro-tilting plate with a hole in the center are compared with a COMSOL simulation model and show good agreement. The analytical models have been used to do design optimization that maximizes sensitivity. The micro-cantilever analytical model does not show good agreement with a COMSOL simulation model. To further investigate, the air damping pressures at several points on the micro-cantilever have been compared between analytical model and COMSOL model. The analytical model is inadequate for two reasons. First, the model’s boundary condition assumption is not realistic. Second, the deflection shape of the cantilever changes with the hole size, and the model does not account for this. Design optimization of micro-cantilever is done by COMSOL.