In-situ detection of defect formation in organic flexible electronics by Kelvin Probe Force Microscopy

Organic semiconductor technology has attracted considerable research interest in view of its great promise for large area, lightweight, and flexible electronics applications. Owing to their advantages in processing and unique physical properties, organic semiconductors can bring exciting new opportunities for broad-impact applications requiring large area coverage, mechanical flexibility, low-temperature processing, and low cost. In order to achieve highly flexible device architecture it is crucial to understand on a microscopic scale how mechanical deformation affects the electrical performance of organic thin film devices. Towards this aim, I established in this thesis the experimental technique of Kelvin Probe Force Microscopy (KPFM) as a tool to investigate the morphology and the surface potential of organic semiconducting thin films under mechanical strain. KPFM has been employed to investigate the strain response of two different Organic Thin Film Transistor with active layer made by 6,13-bis(triisopropylsilylethynyl)-pentacene (TIPS-Pentacene), and Poly(3-hexylthiophene-2,5-diyl) (P3HT). The results show that this technique allows to investigate on a microscopic scale failure of flexible TFT with this kind of materials during bending. I find that the abrupt reduction of TIPS-pentacene device performance at critical bending radii is related to the formation of nano-cracks in the microcrystal morphology, easily identified due to the abrupt variation in surface potential caused by local increase in resistance. Numerical simulation of the bending mechanics of the transistor structure further identifies the mechanical strain exerted on the TIPS-pentacene micro-crystals as the fundamental origin of fracture. Instead for P3HT based transistors no significant reduction in electrical performance is observed during bending. This finding is attributed to the amorphous nature of the polymer giving rise to an elastic response without the occurrence of crack formation.

Design and implementation of a non-destructive defect detection technique based on UWB-SAR imaging

In the last twenty years aerospace and automotive industries started working widely with composite materials, which are not easy to test using classic Non-Destructive Inspection (NDI) techniques. Pairwise, the development of safety regulations sets higher and higher standards for the qualification and certification of those materials. In this thesis a new concept of a Non-Destructive defect detection technique is proposed, based on Ultrawide-Band (UWB) Synthetic Aperture Radar (SAR) imaging. Similar SAR methods are yet applied either in minefield [22] and head stroke [14] detection. Moreover feasibility studies have already demonstrated the validity of defect detection by means of UWB radars [12, 13]. The system was designed using a cheap commercial off-the-shelf radar device by Novelda and several tests of the developed system have been performed both on metallic specimen (aluminum plate) and on composite coupon (carbon fiber). The obtained results confirm the feasibility of the method and highlight the good performance of the developed system considered the radar resolution. In particular, the system is capable of discerning healthy coupons from damaged ones, and correctly reconstruct the reflectivity image of the tested defects, namely a 8 x 8 mm square bulge and a 5 mm drilled holes on metal specimen and a 5 mm drilled hole on composite coupon.