3 resultados para etch-and-rinse adhesive

em AMS Tesi di Laurea - Alm@DL - Università di Bologna


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A really particular and innovative metal-polymer sandwich material is Hybrix. Hybrix is a product developed and manufactured by Lamera AB, Gothenburg, Sweden. This innovative hybrid material is composed by two relatively thin metal layers if compared to the core thickness. The most used metals are aluminum and stainless steel and are separated by a core of nylon fibres oriented perpendicularly to the metal plates. The core is then completed by adhesive layers applied at the PA66-metal interface that once cured maintain the nylon fibres in position. This special material is very light and formable. Moreover Hybrix, depending on the specific metal which is used, can achieve a good corrosion resistance and it can be cut and punched easily. Hybrix architecture itself provides extremely good bending stiffness, damping properties, insulation capability, etc., which again, of course, change in magnitude depending in the metal alloy which is used, its thickness and core thickness. For these reasons nowadays it shows potential for all the applications which have the above mentioned characteristic as a requirement. Finally Hybrix can be processed with tools used in regular metal sheet industry and can be handled as solid metal sheets. In this master thesis project, pre-formed parts of Hybrix were studied and characterized. Previous work on Hybrix was focused on analyze its market potential and different adhesive to be used in the core. All the tests were carried out on flat unformed specimens. However, in order to have a complete description of this material also the effect of the forming process must be taken into account. Thus the main activities of the present master thesis are the following: Dynamic Mechanical-Thermal Analysis (DMTA) on unformed Hybrix samples of different thickness and on pre-strained Hybrix samples, pure epoxy adhesive samples analysis and finally moisture effects evaluation on Hybrix composite structure.

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Nowadays the medical field is struggling to decrease bacteria biofilm formation which leads to infection. Biomedical devices sterilization has not changed over a long period of time. This results in high costs for hospitals healthcare managements. The objective of this project is to investigate electric field effects and surface energy manipulation as solutions for preventing bacteria biofilm for future devices. Based on electrokinectic environments 2 different methods were tested: feasibility of electric gradient through mediums (DEP) reinforced by numerical simulations; and EWOD by the fabrication of golden interdigitated electrodes on silicon glass substrates, standard ~480 nm Teflon (PTFE) layer and polymeric gasket to contain the bacteria medium. In the first experiment quantitative analysis was carried out to achieve forces required to reject bacteria without considering dielectric environment limitations as bacteria and medium frequency dependence. In the second experiment applied voltages was characterized by droplets contact angle measurements and put to the live bacteria tests. The project resulted on promising results for DEP application due to its wide range of frequency that can be used to make a “general” bacteria rejecting; but in terms of practicality, EWOD probably have higher potential for success but more experiments are needed to verify if can prevent biofilm adhesion besides the Teflon non-adhesive properties (including limitations as Teflon breakthrough, layer sensitivity) at incubation times larger than 24 hours.

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Research on adhesive joints is arousing increasing interest in aerospace industry. Incomplete knowledge of fatigue in adhesively bonded joints is a major obstacle to their application. The prediction of the disbonding growth is yet an open question. This thesis researches the influence of the adhesive thickness on fatigue disbond growth. Experimental testing on specimens with different thickness has been performed. Both a conventional approach based on the strain energy release rate and an approach based on cyclic strain energy are provided. The inadequacy of the former approach is discussed. Outcomes from tests support the idea of correlating the crack growth rate to the cyclic strain energy. In order to push further the study, a 2D finite element model for the prediction of disbond growth under quasi-static loading has been developed and implemented in Abaqus. Numerical simulations have been conducted with different values of the adhesive thickness. The results from tests and simulations are in accordance with each other. According to them, no dependence of disbonding on the adhesive thickness has been evidenced.