Studio di catalisi termoattivate per compositi poliuretanici

One of the key processing parameters in thermoset composites manufacturing is to have an optimum balance between open time and cure time. Long open times followed with a fast cure profile (also referred as snap cure or “hockey stick” shaped profiles) are required on applications like Pultrusion, Filament Winding, Resin Transfer Molding (RTM) and Infusion. In this work, several factors affecting the reactivity of a base line polyurethane formulation were studied. The addition of different components such as internal mold release agents, cross-linker, polyols having different molecular structure and isocyanates having different functionality were studied. A literature search was conducted to identify the main catalyst packages existing in the market. The reactivity of catalyst based on tertiary amines, orgamometallic salts, and co-catalyst of amine-organometallic complexes was characterized. Addition of quelants agents such as thioglycerol and acetyl acetone to delay the catalyst activity were also considered. As a consequence of this work a vast reactivity map was generated. This should guide the formulation designer in future product generations for the further development of the mentioned applications. Recommendations on measurements systems and further areas of exploration are also given.

Study of the mechanisms of shear transfer in fiber-reinforced concrete elements

matlab functions for the validation of push-off tests results

Valutazione dell'effetto dell'invecchiamento termico sulle proprietà meccaniche di materiali compositi

L’obiettivo della presente tesi è analizzare, attraverso una campagna sperimentale, gli effetti dell’invecchiamento termico su materiali compositi avanzati. Due serie di provini, ottenuti da pannelli di fibra di carbonio/resina epossidica realizzati rispettivamente con le tecniche di produzione tramite laminazione manuale e RTM (Resin Transfer Molding), sono stati condizionati in forno o in congelatore per un determinato tempo e successivamente sottoposti a test di caratterizzazione meccanica. In questo modo sono state confrontate le prestazioni delle due tecnologie al fine di verificare l’applicabilità del processo RTM a prodotti di alta qualità. I campioni, impiegati nel presente studio, sono stati realizzati scegliendo una configurazione cross-ply, che ben si adatta alle successive fasi della campagna. Sui provini ottenuti sono stati eseguiti dei test di resistenza alla delaminazione tramite una pressa con supporti adattati appositamente allo scopo. Questa campagna sperimentale è stata svolta presso i laboratori hangar della Scuola di Ingegneria e Architettura dell’Università di Bologna, sede di Forlì. La caratterizzazione del materiale è avvenuta mediante prove a flessione D2344.

In-situ detection of defect formation in organic flexible electronics by Kelvin Probe Force Microscopy

Organic semiconductor technology has attracted considerable research interest in view of its great promise for large area, lightweight, and flexible electronics applications. Owing to their advantages in processing and unique physical properties, organic semiconductors can bring exciting new opportunities for broad-impact applications requiring large area coverage, mechanical flexibility, low-temperature processing, and low cost. In order to achieve highly flexible device architecture it is crucial to understand on a microscopic scale how mechanical deformation affects the electrical performance of organic thin film devices. Towards this aim, I established in this thesis the experimental technique of Kelvin Probe Force Microscopy (KPFM) as a tool to investigate the morphology and the surface potential of organic semiconducting thin films under mechanical strain. KPFM has been employed to investigate the strain response of two different Organic Thin Film Transistor with active layer made by 6,13-bis(triisopropylsilylethynyl)-pentacene (TIPS-Pentacene), and Poly(3-hexylthiophene-2,5-diyl) (P3HT). The results show that this technique allows to investigate on a microscopic scale failure of flexible TFT with this kind of materials during bending. I find that the abrupt reduction of TIPS-pentacene device performance at critical bending radii is related to the formation of nano-cracks in the microcrystal morphology, easily identified due to the abrupt variation in surface potential caused by local increase in resistance. Numerical simulation of the bending mechanics of the transistor structure further identifies the mechanical strain exerted on the TIPS-pentacene micro-crystals as the fundamental origin of fracture. Instead for P3HT based transistors no significant reduction in electrical performance is observed during bending. This finding is attributed to the amorphous nature of the polymer giving rise to an elastic response without the occurrence of crack formation.