2 resultados para COPPER ELECTRODEPOSITION

em AMS Tesi di Laurea - Alm@DL - Università di Bologna


Relevância:

20.00% 20.00%

Publicador:

Resumo:

Nowadays, rechargeable Li-ion batteries play an important role in portable consumer devices. Formulation of such batteries is improvable by researching new cathodic materials that present higher performances of cyclability and negligible efficiency loss over cycles. Goal of this work was to investigate a new cathodic material, copper nitroprusside, which presents a porous 3D framework. Synthesis was carried out by a low-cost and scalable co-precipitation method. Subsequently, the product was characterized by means of different techniques, such as TGA, XRF, CHN elemental analysis, XRD, Mössbauer spectroscopy and cyclic voltammetry. Electrochemical tests were finally performed both in coin cells and by using in situ cells: on one hand, coin cells allowed different formulations to be easily tested, on the other operando cycling led a deeper insight to insertion process and both chemical and physical changes. Results of several tests highlighted a non-reversible electrochemical behavior of the material and a rapid capacity fading over time. Moreover, operando techniques report that amorphisation occurs during the discharge.

Relevância:

20.00% 20.00%

Publicador:

Resumo:

In this thesis we have identified two electrochemical procedures for preparing two compounds of copper hexacyanoferrate (CuHCF) films with different compositions and structures. The deposition were carried out using a “two steps” method consisting in electrochemical oxidation of previously deposited metallic copper on carbon substrates (glassy carbon and graphite foil electrodes) in K3[Fe(CN)6] solution. Both films, CuHCF-methodA and CuHCF-methodB, were characterized by cyclic voltammetry (GC) and their study using XANES spectroscopy revealed evidence of different structures. Additionally, insertion and extraction of different cations (Na+, K+, Mg2+, Al3+ and Cs+) were performed and the results indicate that CuHCF-methodA has slightly better performances and operational stability than CuHCF-methodB. Data from galvanostatic charge-discharge tests confirme the latter observation. An application for amperometric detection of H2O2 and SEM micrographs are also reported for both films (method A and B). Comparing these results with a previous work of our research group, seems that the deposition of two different compounds using methodA and methodB is due to the different stoichiometry of ions Cu2+ e [Fe(CN)6]3– created near electrode surface during the dissolution step.