Experimental characterization of backscattering properties of UWB antennas in the presence of close objects

RTLS and RFID systems are becoming more and more important in several fields. When these systems meet the UWB technology, they can take advantage of each other strengths. Since nowadays a strong importance is given to the "green" technology, we chose to adopt a passive solution. In this case the backscattering modulation can be used to carry data. Therefore it is necessary to analyze the behavior of the antennas used as tags, when they are closed to dierent material objects. In particular, the antenna mode part has been deeply observed, as it is the crucial part of the signal regarding the backscatter modulation.

In-situ detection of defect formation in organic flexible electronics by Kelvin Probe Force Microscopy

Organic semiconductor technology has attracted considerable research interest in view of its great promise for large area, lightweight, and flexible electronics applications. Owing to their advantages in processing and unique physical properties, organic semiconductors can bring exciting new opportunities for broad-impact applications requiring large area coverage, mechanical flexibility, low-temperature processing, and low cost. In order to achieve highly flexible device architecture it is crucial to understand on a microscopic scale how mechanical deformation affects the electrical performance of organic thin film devices. Towards this aim, I established in this thesis the experimental technique of Kelvin Probe Force Microscopy (KPFM) as a tool to investigate the morphology and the surface potential of organic semiconducting thin films under mechanical strain. KPFM has been employed to investigate the strain response of two different Organic Thin Film Transistor with active layer made by 6,13-bis(triisopropylsilylethynyl)-pentacene (TIPS-Pentacene), and Poly(3-hexylthiophene-2,5-diyl) (P3HT). The results show that this technique allows to investigate on a microscopic scale failure of flexible TFT with this kind of materials during bending. I find that the abrupt reduction of TIPS-pentacene device performance at critical bending radii is related to the formation of nano-cracks in the microcrystal morphology, easily identified due to the abrupt variation in surface potential caused by local increase in resistance. Numerical simulation of the bending mechanics of the transistor structure further identifies the mechanical strain exerted on the TIPS-pentacene micro-crystals as the fundamental origin of fracture. Instead for P3HT based transistors no significant reduction in electrical performance is observed during bending. This finding is attributed to the amorphous nature of the polymer giving rise to an elastic response without the occurrence of crack formation.

Design and Characterization of an Active Three-Phase EMI Noise Separator for Three-Phase Power Electronics Systems

One of the major issues for power converters that are connected to the electric grid are the measurement of three phase Conduced Emissions (CE), which are regulated by international and regional standards. CE are composed of two components which are Common Mode (CM) noise and Differential Mode (DM) noise. To achieve compliance with these regulations the Equipment Under Test (EUT) includes filtering and other electromagnetic emission control strategies. The separation of differential mode and common mode noise in Electromagnetic Interference (EMI) analysis is a well-known procedure which is useful especially for the optimization of the EMI filter, to improve the CM or DM attenuation depending on which component of the conducted emissions is predominant, and for the analysis and the understanding of interference phenomena of switched mode power converters. However, separating both components is rarely done during measurements. Therefore, in this thesis an active device for the separation of the CM and DM EMI noise in three phase power electronic systems has been designed and experimentally analysed.