Cooperative and reconfigurable telecommunication systems based on FPGA

This work has been realized by the author in his PhD course in Electronics, Computer Science and Telecommunication at the University of Bologna, Faculty of Engineering, Italy. The subject of this thesis regards important channel estimation aspects in wideband wireless communication systems, such as echo cancellation in digital video broadcasting systems and pilot aided channel estimation through an innovative pilot design in Multi-Cell Multi-User MIMO-OFDM network. All the documentation here reported is a summary of years of work, under the supervision of Prof. Oreste Andrisano, coordinator of Wireless Communication Laboratory - WiLab, in Bologna. All the instrumentation that has been used for the characterization of the telecommunication systems belongs to CNR (National Research Council), CNIT (Italian Inter-University Center), and DEIS (Dept. of Electronics, Computer Science, and Systems). From November 2009 to May 2010, the author spent his time abroad, working in collaboration with DOCOMO - Communications Laboratories Europe GmbH (DOCOMO Euro-Labs) in Munich, Germany, in the Wireless Technologies Research Group. Some important scientific papers, submitted and/or published on IEEE journals and conferences have been produced by the author.

Interconnection systems for highly integrated computation devices

The sustained demand for faster,more powerful chips has beenmet by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SOC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MPSOC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NOCS) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the on-chip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation focuses on all of the above points, by describing a NoC architectural implementation called ×pipes; a NoC simulation environment within a cycle-accurate MPSoC emulator called MPARM; a NoC design flow consisting of a front-end tool for optimal NoC instantiation, called SunFloor, and a set of back-end facilities for the study of NoC physical implementations. This dissertation proves the viability of NoCs for current and upcoming designs, by outlining their advantages (alongwith a fewtradeoffs) and by providing a full NoC implementation framework. It also presents some examples of additional extensions of NoCs, allowing e.g. for increased fault tolerance, and outlines where NoCsmay find further application scenarios, such as in stacked chips.

High-performance switching architectures for optical networks

The need for high bandwidth, due to the explosion of new multi\-media-oriented IP-based services, as well as increasing broadband access requirements is leading to the need of flexible and highly reconfigurable optical networks. While transmission bandwidth does not represent a limit due to the huge bandwidth provided by optical fibers and Dense Wavelength Division Multiplexing (DWDM) technology, the electronic switching nodes in the core of the network represent the bottleneck in terms of speed and capacity for the overall network. For this reason DWDM technology must be exploited not only for data transport but also for switching operations. In this Ph.D. thesis solutions for photonic packet switches, a flexible alternative with respect to circuit-switched optical networks are proposed. In particular solutions based on devices and components that are expected to mature in the near future are proposed, with the aim to limit the employment of complex components. The work presented here is the result of part of the research activities performed by the Networks Research Group at the Department of Electronics, Computer Science and Systems (DEIS) of the University of Bologna, Italy. In particular, the work on optical packet switching has been carried on within three relevant research projects: the e-Photon/ONe and e-Photon/ONe+ projects, funded by the European Union in the Sixth Framework Programme, and the national project OSATE funded by the Italian Ministry of Education, University and Scientific Research. The rest of the work is organized as follows. Chapter 1 gives a brief introduction to network context and contention resolution in photonic packet switches. Chapter 2 presents different strategies for contention resolution in wavelength domain. Chapter 3 illustrates a possible implementation of one of the schemes proposed in chapter 2. Then, chapter 4 presents multi-fiber switches, which employ jointly wavelength and space domains to solve contention. Chapter 5 shows buffered switches, to solve contention in time domain besides wavelength domain. Finally chapter 6 presents a cost model to compare different switch architectures in terms of cost.

Models for reliability estimation of HVDC cable systems

The work carried out in this thesis aims at: - studying – in both simulative and experimental methods – the effect of electrical transients (i.e., Voltage Polarity Reversals VPRs, Temporary OverVoltages TOVs, and Superimposed Switching Impulses SSIs) on the aging phenomena in HVDC extruded cable insulations. Dielectric spectroscopy, conductivity measurements, Fourier Transform Infra-Red FTIR spectroscopy, and space charge measurements show variation in the insulating properties of the aged Cross-Linked Polyethylene XLPE specimens compared to non-aged ones. Scission in XLPE bonds and formation of aging chemical bonds is also noticed in aged insulations due to possible oxidation reactions. The aged materials show more ability to accumulate space charges compared to non-aged ones. An increase in both DC electrical conductivity and imaginary permittivity has been also noticed. - The development of life-based geometric design of HVDC cables in a detailed parametric analysis of all parameters that affect the design. Furthermore, the effect of both electrical and thermal transients on the design is also investigated. - The intrinsic thermal instability in HVDC cables and the effect of insulation characteristics on the thermal stability using a temperature and field iterative loop (using numerical methods – Finite Difference Method FDM). The dielectric loss coefficient is also calculated for DC cables and found to be less than that in AC cables. This emphasizes that the intrinsic thermal instability is critical in HVDC cables. - Fitting electrical conductivity models to the experimental measurements using both models found in the literature and modified models to find the best fit by considering the synergistic effect between field and temperature coefficients of electrical conductivity.