8 resultados para semiconductor strain gage

em Repositório Institucional UNESP - Universidade Estadual Paulista "Julio de Mesquita Filho"


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This paper describes the development of a semiconductor strain gage tactile transducer. It was designed with the goal of measuring finger forces without affecting the hand dexterity. The transducer structure was manufactured with stainless steel and has small dimensions ( 4 min diameter and I min thickness). It is light and suitable to connect to the finger pads. It has a device that prevents its damage when forces are applied. The semiconductor strain gage was used over due its small size and high sensitivity, although it has high temperature sensitivity. Theory, design and construction details are presented the signal conditioning circuit is very simple because the semiconductor strain gage sensitivity is high. It presents linear response from 0 to 100 N, 0.5 N resolution, fall time of 7.2 ms, good repeatability, and small hysteresis. The semiconductor strain gage transducer has characteristics that can make it very useful in Rehabilitation Engineering, Robotics, and Medicine.

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This paper describes a high senstivity low cost capacitive strain gage sensor. The theory, design, and sensor construction details are presented. It consists of eight capacitive sensors connected in two full bridges. The capacitive strain gage sensor structure was designed in order to produce high sensitivity and low dependence with temperature. By using a simple signal conditioning circuit constituted by a differential amplifier, a band-pass filter, and a precision rectifier the device can measure forces with resolution of 0.009 N and precision of 98.7%. It is rugged, presents linear response, and good repeatability. It presents sensitivity of 8.7 V/N and fall time of 12 ms.

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This paper describes a strain gauge-based sensor used for measuring finger force. The theory, design, and sensor construction details are presented. It was constructed using metallic strain gauges and a carefully designed structure which has a protection de-vice that impedes the sensor damage when forces higher than 100 N are applied. Its dimensions are suitable for measuring thumb force, but the same design can be used for constructing smaller sensors for other fingers. It is rugged, presents linear response, good repeatability, resolution of 0.3 N, low hysteresis, and sensitivity of 0.12 V/N. It can be useful in rehabilitation engineering, biomechanics, robotics, and medicine.

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Aerodynamic balances are employed in wind tunnels to estimate the forces and moments acting on the model under test. This paper proposes a methodology for the assessment of uncertainty in the calibration of an internal multi-component aerodynamic balance. In order to obtain a suitable model to provide aerodynamic loads from the balance sensor responses, a calibration is performed prior to the tests by applying known weights to the balance. A multivariate polynomial fitting by the least squares method is used to interpolate the calibration data points. The uncertainties of both the applied loads and the readings of the sensors are considered in the regression. The data reduction includes the estimation of the calibration coefficients, the predicted values of the load components and their corresponding uncertainties, as well as the goodness of fit.

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Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)

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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

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The present work aims to study the possible causes of cracks founded and recovered in translation cars of ore Forklift / ore Reclaimer. To identify the possible causes of cracks observed on the equipment it was used a static approach analysis, using a finite element method as an analysis tool, using a specific structural analysis program. After making the model, a strain gage measurement was necessary because there may be significant amounts of masses of non-structural components that were not modeled and were not available in the drawings, as well as fouling ore. With the calibrated model it was processed analyses with the load cases of dead load, product, wind and excavation. After the processing, it was observed that none of these load cases resulted in values that caused the crack, so another three hypotheses were tested: depression and misalignment, jacking and translation of only three cars. Of these three hypotheses it was observed that the jacking coud be the cause of the cracks, because the distribution of stress. Due to the miss of parameters, like the height utilized in this process, it was not possible to affirm the real stress level

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The hexagonal nanomembranes of the group III-nitrides are a subject of interest due to their novel technological applications. In this paper, we investigate the strain- and electric field-induced modulation of their band gaps in the framework of density functional theory. For AlN, the field-dependent modulation of the bandgap is found to be significant whereas the strain-induced semiconductor-metal transition is predicted for GaN. A relatively flat conduction band in AlN and GaN nanomembranes leads to an enhancement of their electronic mobility compared to that of their bulk counterparts. © 2013 IOP Publishing Ltd.