Estudo das propriedades mecânicas do concreto com adição de cinza de casca de arroz

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

The effect of thermal cycles on the mechanical properties of fiber-metal laminates

The effect of thermal-shock cycles on the mechanical properties of fiber-metal laminates (FMLs) has been evaluated. FML plates were composed by two AA2024 Al sheets (1.6 mm thick) and one composite ply formed by two layers of unidirectional glass fiber epoxy prepreg and two layers of epoxy adhesive tape of glass fiber reinforced epoxy adhesive. The set was manufactured by hand layup and typical vacuum bag technique. The curing cycle was in autoclave at 125 +/- 5 degrees C for 90 min and an autoclave pressure of 400 kPa. FML coupons taken from the manufactured plate were submitted to temperature variations between -50 and +80 degrees C, with a fast transition between these temperatures. Tensile and interlaminar shear strength were evaluated on samples after 1000 and 2000 cycles, and compared to nonexposed samples. 2000 Cycles corresponds to typical C Check interval for commercial aircraft maintenance programs. It was observed that the thermal-shock cycles did not result in significant microstructural changes on the FML, particularly on the composite ply. Similarly, no appreciable effect on the mechanical properties of FML was observed by the thermal-shock cycles. (c) 2012 Elsevier Ltd. All rights reserved.

Structural carbon/epoxy prepregs properties comparison by thermal and rheological analyses

Two different carbon/epoxy prepreg materials were characterized and compared using thermal (DSC, TGA, and DMA) and rheological analyses. A prepreg system (carbon fiber preimpregnated with epoxy resin F584) that is currently used in the commercial airplane industry was compared with a prepreg system that is a prospective candidate for the same applications (carbon fiber prepreg/epoxy resin 8552). The differences in the curing kinetics mechanisms of both prepreg systems were identified through the DSC, TGA, DMA, and rheological analyses. Based on these thermal analysis techniques, it was verified that the curing of both epoxy resin systems follow a cure kinetic of n order. Even though their reaction heats were found to be slightly different, the kinetics of these systems were nevertheless very similar. The activation energies for both prepreg systems were determined by DSC analysis, using Arrhenius's method, and were found to be quite similar. DMA measurements of the cured prepregs demonstrated that they exhibited similar degrees of cure and different glass transition temperatures. Furthermore, the use of the rheological analysis revealed small differences in the gel temperatures of the two prepreg systems that were examined.

Dielectric thermal analysis as a tool for quantitative-evaluation of the viscosity and the kinetics of epoxy resin cure

Dielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing process and the related rheological properties in the fabrication of polymer-matrix composite materials. This technique also has the potential to be applied in the monitoring of magnet impregnation processes as well as in quality control. In this work we present the quantitative evaluation of the viscosity changing and the curing kinetics for a commercial Stycast epoxy resin system at different temperatures through the impedance analysis. The results showed correlation between the real component of the complex impedance and the isothermal reaction extent. Comparing the dielectric analysis result with the viscosity measured by rotational rheometer we observed a similar behavior reported for dynamic mechanic analysis. The results comparison have shown that the kinetics parameters obtained from DSC and DETA analysis showed different sensitivities related to the characteristics of curing stages. We concluded that the dielectric thermal analysis should be applied in quantitative evaluation of cure kinetics.