307 resultados para Electrochemical impedance spectroscopy techniques
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Pós-graduação em Química - IQ
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
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Pós-graduação em Química - IQ
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Pós-graduação em Química - IQ
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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
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Pós-graduação em Química - IQ
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Pós-graduação em Biotecnologia - IQ
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Pós-graduação em Química - IQ
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Pós-graduação em Química - IQ
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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
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The glassy carbon is a material with a huge technological evolution. Due to its lightness, biocompatibility and their thermal and electrical properties this material finds applications in several industrial fields such as electronics, medical, aerospace and chemical. In order to explore the conductive properties of glassy carbon for use as modified electrodes, the present work aims the processing of monolithic and reticulated glassy carbon with colloidal copper for use in electrochemical applications. First, the best parameters for the cure of furfuryl alcohol resin doped were established through viscosimetry measurements and pressurized differential scanning calorimetry. The analysis of the micrographs of the cured resins show that copper concentrations above 3% weight, generate higher porosity in the material. The characterizations of the monolithic and reticulated glassy carbon resulting from carbonization were performed by scanning electron microscopy (SEM), Raman and Electrochemical impedance spectroscopy, and although it was not possible to detect the presence of copper by SEM, the influence of these particles have been observed by Raman and FT-IR spectra and electrochemical behavior of the material. The decrease in conductivity of monolithic and reticulated glassy carbon in the presence of copper may be related to the defects caused by the presence of copper in the structure of the material.