77 resultados para cooling chip for handheld electronic devices


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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

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In this work design criteria for cooling of electronic systems used in a digital transmission equipment are considered. An experimental study using a simulated electronic equipment in which vertically oriented circuit boards are aligned to form vertical channels is carried out. Resistors are used to simulate actual components. The temperature of several components in the printed circuit boards are measured and the influence of the baffles and shields on the cooling effect are discussed. It was observed that the use of the baffles reduce the temperature levels and, the use of shields, although protecting the components from magnetic effects, cause an increase in the temperature levels.