Preparation of silica abrasives from water glass and application in silicon wafer polishing

Chemical mechanical polishing technique is more frequently adopted for planarization in integrated circuit fabrication. The silica abrasives in colloidal state are fabricated with the sodium silicate solution as raw materials through the polymerization reaction among silicic acid molecules. By continuous injection of silicic acid into the preexisting silica solution, the diameter of silica nanoparticles increases. The different sized silica nanoparticles are imaged by scanning electron microscopy, and the dried silica are characterized by X-ray diffraction and thermal analysis. The polishing test on silicon wafer with as-fabricated silica abrasives shows that the surface flatness reaches 1.1 nm roughness, however, micro scratches are still present in the surface.

Boron nitride colloidal solutions, ultralight aerogels and freestanding membranes through one-step exfoliation and functionalization

Manufacturing of aerogels and membranes from hexagonal boron nitride (h-BN) is much more difficult than from graphene or graphene oxides because of the poor dispersibility of h-BN in water, which limits its exfoliation and preparation of colloidal solutions. Here, a simple, one-step mechano-chemical process to exfoliate and functionalize h-BN into highly water-dispersible, few-layer h-BN containing amino groups is presented. The colloidal solutions of few-layer h-BN can have unprecedentedly high concentrations, up to 30 mg ml(-1), and are stable for up to several months. They can be used to produce ultralight aerogels with a density of 1.4 mg cm(-3), which is ∼1,500 times less than bulk h-BN, and freestanding membranes simply by cryodrying and filtration, respectively. The material shows strong blue light emission under ultraviolet excitation, in both dispersed and dry state.