Integrated fluid-thermal-structural numerical analysis for the quenching of metallic components

The quenching of a metal component with a channel section in a water tank is numerically simulated. Computational fluid dynamics (CFD) is used to model the multiphase flow and the heat transfer in film boiling, nucleate boiling and convective cooling processes to calculate the difference in heat transfer rate around the component and then combining with the thermal simulation and structure analysis of the component to study the effect of heat transfer rate on the distortion of the U-channel component. A model is also established to calculate the residual stress produced by quenching. The coupling fluid-thermal-structural simulation provides an insight into the deformation of the component and can be used to perform parameter analysis to reduce the distortion of the component. © 2011 Shanghai Jiaotong University and Springer-Verlag Berlin Heidelberg.

Nano-carbon electrodes for thermal energy harvesting

Thermogalvanic cells are capable of converting waste heat (generated as a by-product of almost all human activity) to electricity. These devices may alleviate the problems associated with the use of fossil fuels to meet the world's current demand for energy. This review discusses the developments in thermogalvanic systems attained through the use of nano-carbons as the electrode materials. Advances in cell design and electrode configuration that improve performance of these thermo converters and make them applicable in a variety of environments are also summarized. It is the aim of this review to act as a channel for further developments in thermogalvanic cell design and electrode engineering.

Thermal behavior of copper processed by ECAP with and without back pressure

Samples of electrolytic tough pitch (ETP) pure copper were subjected to 12 passes of Equal-Channel Angular Pressing (ECAP) at room temperature with and without back pressure. Subsequent annealing was performed to evaluate the influence of back pressure during ECAP on the thermal behavior of ultrafine-grained copper. The microstructural and hardness changes caused by annealing were characterized by orientation imaging microscopy (OIM) and microhardness measurements. The application of back pressure resulted in an earlier drop in hardness upon annealing, which is believed to be associated with a lower critical temperature for the initiation of recrystallization and a rapid coarsening of microstructure. Regardless of whether back pressure was applied or not, structure coarsening during short-time annealing of ECAP-processed copper was governed by discontinuous static recrystallization. This is seen as a result of microstructure heterogeneity. Analysis of recrystallization kinetics was carried out based on observations of the microstructure after annealing in terms of the Avrami equation. The magnitude of the apparent activation energies for recrystallization in the absence of back pressure and in the case of back pressure of 100 MPa was estimated to be ~99 kJ/mol and ~91 kJ/mol, respectively. The reasons for reduced activation energy in the case of processing with back pressure are discussed.