9 resultados para SILICON-ON-INSULATOR

em Deakin Research Online - Australia


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Single pass warm rolling and compression experiments were carried out from ambient to 800°C for ultra-low carbon (ULC) steel with ∼100 ppm carbon and interstitial free (IF) steels, both with two levels of silicon. Subsequently, annealing was done in order to recrystallize the deformed specimens. The main purpose of this study was to understand the effects of rolling temperature and silicon on stress responses and textures. This study comprises two main themes: flow stress and strain rate sensitivity during compression and shear banding and textures in warm rolled specimens. The effects of deformation temperature on in-grain shear bands were different between ULC-Si and IF-Si steels. As in previous work with more conventional steels, in-grain shear bands in the IF grade had low sensitivity to rolling temperature, while those in the ULC grade depended significantly on the deformation temperature. However, the temperature profile of shear banding in the ULC grade was approximately 150°C higher than in previous work. Deformation and recrystallisation textures for both IF and ULC grades depended on their rolling temperatures. The variation of both grain size and texture after annealing can be explained by the rise and fall of in-grain shear banding activity which is related to the strain rate sensitivity.

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Isothermal transformation (TTT) behavior of the low carbon steels with two Si contents (0.50 wt pct and 1.35 wt pct) was investigated with and without the prior deformation. The results show that Si and the prior deformation of the austenite have significant effiects on the transformation of the ferrite and bainite. The addition of Si refines the ferrite grains, accelerates the polygonal ferrite transformation and the formation of M/A constituents, leading to the improvement of the strength. The ferrite grains formed under the prior deformation of the austenite become more homogeneous and refined. However, the influence of deformation on the tensile strength of both steels is dependent on the isothermal temperatures. Thermodynamic calculation indicates that Si and prior deformation reduce the incubation time of both ferrite and bainite transformation, but the effiect is weakened by the decrease of the isothermal temperatures.

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After 2% predeformation, the baking treatment with different schedule was carried out for low silicon TRIP steel sheet with niobium. The effects of baking temperature and time on microstructures and mechanical properties were investigated. The results showed that with increasing the baking temperature and time, the volume fraction of retained austenite decreases, and the volume fraction of tempered martensite increases; as baking temperature ranges from 80°C to 170°C, the bake-hardening (BH) value increases obviously, while from 170°C to 230°C, the variation of BH value is very slight; as baking time ranges from 2 min to 20 min, the BH value increases significantly, while the BH value decreases when baking time exceeds 20 min. So that when the baking temperature is 170°C and the baking time is 20 min, the low silicon TRIP steel sheet exhibits good bake-hardening behavior, and the highest BH value is above 70 MPa.

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In this paper, the fabrication and growth mechanism of net-shaped micropatterned self-organized thin-film TiO2 nanotube (TFTN) arrays on a silicon substrate are reported. Electrochemical anodization is used to grow the nanotubes from thin-film titanium sputtered on a silicon substrate with an average diameter of ?30 nm and a length of ?1.5 ?m using aqueous and organic-based types of electrolytes. The fabrication and growth mechanism of TFTN arrays from micropatterned three-dimensional isolated islands of sputtered titanium on a silicon substrate is demonstrated for the first time using focused-ion-beam (FIB) technique. This work demonstrates the use of the FIB technique as a simple, high-resolution, and maskless method for high-aspect-ratio etching for the creation of isolated islands and shows great promise toward the use of the proposed approach for the development of metal oxide nanostructured devices and their integration with micro- and nanosystems within silicon-based integrated-circuit devices.

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The effects of combined silicon and molybdenum alloying additions on microalloy precipitate formation in austenite after single- and double-step deformations below the austenite no-recrystallization temperature were examined in high-strength low-alloy (HSLA) steels microalloyed with titanium and niobium. The precipitation sequence in austenite was evaluated following an interrupted thermomechanical processing simulation using transmission electron microscopy. Large (~ 105 nm), cuboidal titanium-rich nitride precipitates showed no evolution in size during reheating and simulated thermomechanical processing. The average size and size distribution of these precipitates were also not affected by the combined silicon and molybdenum additions or by deformation. Relatively fine (< 20 nm), irregular-shaped niobium-rich carbonitride precipitates formed in austenite during isothermal holding at 1173 K. Based upon analysis that incorporated precipitate growth and coarsening models, the combined silicon and molybdenum additions were considered to increase the diffusivity of niobium in austenite by over 30% and result in coarser precipitates at 1173 K compared to the lower alloyed steel. Deformation decreased the size of the niobium-rich carbonitride precipitates that formed in austenite.