Comparative study of the microstructures and mechanical properties of direct laser fabricated and arc-melted AlxCoCrFeNi high entropy alloys

High entropy alloys (HEA) are a relatively new metal alloy system that have promising potential in high temperature applications. These multi-component alloys are typically produced by arc-melting, requiring several remelts to achieve chemical homogeneity. Direct laser fabrication (DLF) is a rapid prototyping technique, which produces complex components from alloy powder by selectively melting micron-sized powder in successive layers. However, studies of the fabrication of complex alloys from simple elemental powder blends are sparse. In this study, DLF was employed to fabricate bulk samples of three alloys based on the AlxCoCrFeNi HEA system, where x was 0.3, 0.6 and 0.85M fraction of Al. This produced FCC, FCC/BCC and BCC crystal structures, respectively. Corresponding alloys were also produced by arc-melting, and all microstructures were characterised and compared longitudinal and transverse to the build/solidification direction by x-ray diffraction, glow discharge optical emission spectroscopy and scanning electron microscopy (EDX and EBSD). Strong similarities were observed between the single phase FCC and BCC alloys produced by both techniques, however the FCC/BCC structures differed significantly. This has been attributed to a difference in the solidification rate and thermal gradient in the melt pool between the two different techniques. Room temperature compression testing showed very similar mechanical behaviour and properties for the two different processing routes. DLF was concluded to be a successful technique to manufacture bulk HEA[U+05F3]s.

Improved manufacturing quality and bonding of laser machined microfluidic systems

Laser micro-machining offers a versatile tool for the rapid manufacturing of polymeric microfluidics systems, with a typical turn-around-time in the order of minutes. However, the chaotic nature of the thermal evaporative ablation process can yield a significant number of defects in the surface of the manufactured microchannels, in the form of residual condensed material. In this work we have investigated the use of solvent evaporation by which to not only laminate bond the laser machined structures but to remove a significant number of the defect formed by the condensation of residual polymer. Results are presented of the surface profiling of the bonded channel structures and demonstrations of the bonding of the microchips to produce autonomous capillary microchannels.