93 resultados para Super Austenitic Stainless Steel
Resumo:
Shear bands formed during both cold and hot plastic deformation have been linked with several proposed mechanisms for the formation of ultrafine grains. The aim of the present work was to undertake a detailed investigation of the microstructural and crystallographic characteristics of the shear bands formed during hot deformation of a 22Cr-19Ni-3Mo (mass%) austenitic stainless steel and a Fe-30 mass%Ni based austenitic model alloy. These alloys were subjected to deformation in torsion and plane strain compression (PSC), respectively, at temperatures of 900°C and 950°C and strain rates of 0.7s-1 and 10s-1, respectively. Transmission electron microscopy and electron backscatter diffraction in conjunction with scanning electron microscopy were employed in the investigation. It has been observed that shear bands already started to form at moderate strains in a matrix of pre-existing microbands and were composed of fine, slightly elongated subgrains (fragments). These bands propagated along a similar macroscopic path and the subgrains, present within their substructure, were rotated relative to the surrounding matrix about axes approximately parallel to the sample radial and transverse directions for deformation in torsion and PSC, respectively. The subgrain boundaries were largely observed to be non-crystallographic, suggesting that the subgrains generally formed via multiple slip processes. Shear bands appeared to form through a co-operative nucleation of originally isolated subgrains that gradually interconnected with the others to form long, thin bands that subsequently thickened via the formation of new subgrains. The observed small dimensions of the subgrains present within shear bands and their large misorientations clearly indicate that these subgrains can serve as potent nucleation sites for the formation of ultrafine grain structures during both subsequent recrystallisation, as observed during the present PSC experiments, and phase transformation.
Resumo:
The microstructure and crystallographic texture characteristics were studied in a 22Cr-6Ni-3Mo duplex stainless steel subjected to plastic deformation in torsion at a temperature of 1000 °C using a strain rate of 1 s−1. High-resolution EBSD was successfully used for precise phase and substructural characterization of this steel. The austenite/ferrite ratio and phase morphology as well as the crystallographic texture, subgrain size, misorientation angles and misorientation gradients corresponding to each phase were determined over large sample areas. The deformation mechanisms in each phase and the interrelationship between the two are discussed.
Resumo:
This data is the result of an investigation into the effect of grain orientation on the substructure development of 304 stainless steel and a Ni-30wt.%Fe alloy. Both alloys have been used as model alloys to study the high temperature deformation of austenite. The development of the dislocation substructure as a function of strain, temperature and grain orientation was investigated using a combination of electron backscatterd diffraction (EBSD) and transmission electron microscopy (TEM).
Resumo:
Data includes EBSD orentation maps of the specimens deformed in torsion at 1200 degrees celsius to strains of 0.1, 0.5, 0.9 and 1.3. The phase ratio is about 60% austenite and 40% ferrite. The miscrostructure is dynamically recovered and there is also some dynamic recrystallisation at strains of 0.9 and 1.3. The main portion of softening can be attributed to dynamic subgrain coalescence in austenite.
Resumo:
The effect of rf-power in the range from 100 to 200 W on the electrochemical properties of TiN coatings deposited on 316L stainless steel was investigated by using various electrochemical techniques in a 3.5-wt\% NaCl solution. Surface analyses were also conducted to analyze the coating characteristics. X-ray diffraction (XRD) and atomic force microscopy (AFM) analyses confirmed that increasing the rf-power led to a preferred orientation of the TiN(200) microstructure and decreased the surface roughness. The potentiodynamic test results confirmed the passive behavior of all of the specimens with low passive current densities and demonstrated that the effective pitting resistance of the TiN coatings increased with increasing rf-power. The electrochemical impedance spectroscopy (EIS) tests showed that the TiN films deposited with high rf-power had excellent corrosion resistance during an immersion time of 720 h due to their high total resistance and low porosity.
Resumo:
A novel electrochemically integrated multi-electrode array namely the wire beam electrode(WBE) in combination with noise signatures analysis has been designed to monitor pittingcorrosion of one of the best corrosion resistance ferrous alloys, stainless steel type 316L.From the direct correlation of electrochemical potential noise signatures and galvanic currentdistribution maps during pitting corrosion processes, two characteristic noise patterns wereobserved prior to stable pit formation: (i) the characteristic ‘peak’ of rapid potential transient,towards less negative direction, followed by recovery (termed noise signature I) was found tocorrelate with the disappearance of unstable anode; (ii) the characteristic noise pattern ofquick potential changes towards less negative direction followed by no recovery (termed noisesignature II) was found to correspond with the massive disappearance of minor anodes leadingto formation of highly localized major anodes in the galvanic current distribution maps.
Resumo:
In the present study, wetting characteristics and evolution of microstructure of Sn–3.5Ag solder on Ag/Ni and Ni electroplated 304 stainless steel (304SS) substrates have been investigated. Solder alloy spread on Ag/Ni plated 304SS substrates exhibited better wetting as compared to Ni/304SS substrate. The formations of irregular shaped and coarser IMCs were found at the interface of solder/Ni/304SS substrate region whereas, solder/Ag/Ni/substrate interface showed continuous scallop and needle shaped IMCs. The precipitation of Ag3Sn, Ni–Sn, FeSn2 and lesser percentage of Fe–Cr–Sn IMCs were found at the interface of solder/Ag/Ni/substrate region whereas, solder/Ni/304 SS substrate exhibited predominantly FeSn2 and Fe–Cr–Sn IMCs. Presence of higher amount of Fe–Cr–Sn IMCs at the solder/Ni/304SS substrate interface inhibited the further wetting of solder alloy.