Corrosion properties of a RF-magnetron-sputtered TiN coating deposited on 316L stainless steel

The effect of rf-power in the range from 100 to 200 W on the electrochemical properties of TiN coatings deposited on 316L stainless steel was investigated by using various electrochemical techniques in a 3.5-wt\% NaCl solution. Surface analyses were also conducted to analyze the coating characteristics. X-ray diffraction (XRD) and atomic force microscopy (AFM) analyses confirmed that increasing the rf-power led to a preferred orientation of the TiN(200) microstructure and decreased the surface roughness. The potentiodynamic test results confirmed the passive behavior of all of the specimens with low passive current densities and demonstrated that the effective pitting resistance of the TiN coatings increased with increasing rf-power. The electrochemical impedance spectroscopy (EIS) tests showed that the TiN films deposited with high rf-power had excellent corrosion resistance during an immersion time of 720 h due to their high total resistance and low porosity.

A novel sensing technique for monitoring pitting corrosion of stainless steel type 316L

A novel electrochemically integrated multi-electrode array namely the wire beam electrode(WBE) in combination with noise signatures analysis has been designed to monitor pittingcorrosion of one of the best corrosion resistance ferrous alloys, stainless steel type 316L.From the direct correlation of electrochemical potential noise signatures and galvanic currentdistribution maps during pitting corrosion processes, two characteristic noise patterns wereobserved prior to stable pit formation: (i) the characteristic ‘peak’ of rapid potential transient,towards less negative direction, followed by recovery (termed noise signature I) was found tocorrelate with the disappearance of unstable anode; (ii) the characteristic noise pattern ofquick potential changes towards less negative direction followed by no recovery (termed noisesignature II) was found to correspond with the massive disappearance of minor anodes leadingto formation of highly localized major anodes in the galvanic current distribution maps.

Wetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substrates

In the present study, wetting characteristics and evolution of microstructure of Sn–3.5Ag solder on Ag/Ni and Ni electroplated 304 stainless steel (304SS) substrates have been investigated. Solder alloy spread on Ag/Ni plated 304SS substrates exhibited better wetting as compared to Ni/304SS substrate. The formations of irregular shaped and coarser IMCs were found at the interface of solder/Ni/304SS substrate region whereas, solder/Ag/Ni/substrate interface showed continuous scallop and needle shaped IMCs. The precipitation of Ag3Sn, Ni–Sn, FeSn2 and lesser percentage of Fe–Cr–Sn IMCs were found at the interface of solder/Ag/Ni/substrate region whereas, solder/Ni/304 SS substrate exhibited predominantly FeSn2 and Fe–Cr–Sn IMCs. Presence of higher amount of Fe–Cr–Sn IMCs at the solder/Ni/304SS substrate interface inhibited the further wetting of solder alloy.