1 resultado para seed coat thickness

em Dalarna University College Electronic Archive


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This degree project aim to evaluate if variations of the STFI thickness can be used to assess bumpiness on cardboard. During the project cardboard samples were measured using Bendtsen, PPS, a L&W formation tester, OptiTopo, Ambertec formation, the STFI thickness tester and a visual comparison. The different methods were then compared to see if there is any correlations between them. The results showed that the visual comparison and OptiTopo correlates. The STFI thickness tester shows however no correlation with the OptiTopo and visual comparison, thus aren't suitable measuring bumpiness.