5 resultados para pixel

em Universitat de Girona, Spain


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In this paper, we present view-dependent information theory quality measures for pixel sampling and scene discretization in flatland. The measures are based on a definition for the mutual information of a line, and have a purely geometrical basis. Several algorithms exploiting them are presented and compare well with an existing one based on depth differences

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We propose a probabilistic object classifier for outdoor scene analysis as a first step in solving the problem of scene context generation. The method begins with a top-down control, which uses the previously learned models (appearance and absolute location) to obtain an initial pixel-level classification. This information provides us the core of objects, which is used to acquire a more accurate object model. Therefore, their growing by specific active regions allows us to obtain an accurate recognition of known regions. Next, a stage of general segmentation provides the segmentation of unknown regions by a bottom-strategy. Finally, the last stage tries to perform a region fusion of known and unknown segmented objects. The result is both a segmentation of the image and a recognition of each segment as a given object class or as an unknown segmented object. Furthermore, experimental results are shown and evaluated to prove the validity of our proposal

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This paper describes a method to achieve the most relevant contours of an image. The presented method proposes to integrate the information of the local contours from chromatic components such as H, S and I, taking into account the criteria of coherence of the local contour orientation values obtained from each of these components. The process is based on parametrizing pixel by pixel the local contours (magnitude and orientation values) from the H, S and I images. This process is carried out individually for each chromatic component. If the criterion of dispersion of the obtained orientation values is high, this chromatic component will lose relevance. A final processing integrates the extracted contours of the three chromatic components, generating the so-called integrated contours image

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It is well known that image processing requires a huge amount of computation, mainly at low level processing where the algorithms are dealing with a great number of data-pixel. One of the solutions to estimate motions involves detection of the correspondences between two images. For normalised correlation criteria, previous experiments shown that the result is not altered in presence of nonuniform illumination. Usually, hardware for motion estimation has been limited to simple correlation criteria. The main goal of this paper is to propose a VLSI architecture for motion estimation using a matching criteria more complex than Sum of Absolute Differences (SAD) criteria. Today hardware devices provide many facilities for the integration of more and more complex designs as well as the possibility to easily communicate with general purpose processors

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La miniaturització de la industria microelectrònica és un fet del tot inqüestionables i la tecnologia CMOS no n'és una excepció. En conseqüència la comunitat científica s'ha plantejat dos grans reptes: En primer lloc portar la tecnologia CMOS el més lluny possible ('Beyond CMOS') tot desenvolupant sistemes d'altes prestacions com microprocessadors, micro - nanosistemes o bé sistemes de píxels. I en segon lloc encetar una nova generació electrònica basada en tecnologies totalment diferents dins l'àmbit de les Nanotecnologies. Tots aquests avanços exigeixen una recerca i innovació constant en la resta d'àrees complementaries com són les d'encapsulat. L'encapsulat ha de satisfer bàsicament tres funcions: Interfície elèctrica del sistema amb l'exterior, Proporcionar un suport mecànic al sistema i Proporcionar un camí de dissipació de calor. Per tant, si tenim en compte que la majoria d'aquests dispositius d'altes prestacions demanden un alt nombre d'entrades i sortides, els mòduls multixip (MCMs) i la tecnologia flip chip es presenten com una solució molt interessant per aquests tipus de dispositiu. L'objectiu d'aquesta tesi és la de desenvolupar una tecnologia de mòduls multixip basada en interconnexions flip chip per a la integració de detectors de píxels híbrids, que inclou: 1) El desenvolupament d'una tecnologia de bumping basada en bumps de soldadura Sn/Ag eutèctics dipositats per electrodeposició amb un pitch de 50µm, i 2) El desenvolupament d'una tecnologia de vies d'or en silici que permet interconnectar i apilar xips verticalment (3D packaging) amb un pitch de 100µm. Finalment aquesta alta capacitat d'interconnexió dels encapsulats flip chip ha permès que sistemes de píxels tradicionalment monolítics puguin evolucionar cap a sistemes híbrids més compactes i complexes, i que en aquesta tesi s'ha vist reflectit transferint la tecnologia desenvolupada al camp de la física d'altes energies, en concret implantant el sistema de bump bonding d'un mamògraf digital. Addicionalment s'ha implantat també un dispositiu detector híbrid modular per a la reconstrucció d'imatges 3D en temps real, que ha donat lloc a una patent.