Profile simulations of gas chopping etching processes : model development and comparison with experiments

The progress in microsystem technology or nano technology places extended requirements to the fabrication processes. The trend is moving towards structuring within the nanometer scale on the one hand, and towards fabrication of structures with high aspect ratio (ratio of vertical vs. lateral dimensions) and large depths in the 100 µm scale on the other hand. Current procedures for the microstructuring of silicon are wet chemical etching and dry or plasma etching. A modern plasma etching technique for the structuring of silicon is the so-called "gas chopping" etching technique (also called "time-multiplexed etching"). In this etching technique, passivation cycles, which prevent lateral underetching of sidewalls, and etching cycles, which etch preferably in the vertical direction because of the sidewall passivation, are constantly alternated during the complete etching process. To do this, a CHF3/CH4 plasma, which generates CF monomeres is employed during the passivation cycle, and a SF6/Ar, which generates fluorine radicals and ions plasma is employed during the etching cycle. Depending on the requirements on the etched profile, the durations of the individual passivation and etching cycles are in the range of a few seconds up to several minutes. The profiles achieved with this etching process crucially depend on the flow of reactants, i.e. CF monomeres during the passivation cycle, and ions and fluorine radicals during the etching cycle, to the bottom of the profile, especially for profiles with high aspect ratio. With regard to the predictability of the etching processes, knowledge of the fundamental effects taking place during a gas chopping etching process, and their impact onto the resulting profile is required. For this purpose in the context of this work, a model for the description of the profile evolution of such etching processes is proposed, which considers the reactions (etching or deposition) at the sample surface on a phenomenological basis. Furthermore, the reactant transport inside the etching trench is modelled, based on angular distribution functions and on absorption probabilities at the sidewalls and bottom of the trench. A comparison of the simulated profiles with corresponding experimental profiles reveals that the proposed model reproduces the experimental profiles, if the angular distribution functions and absorption probabilities employed in the model is in agreement with data found in the literature. Therefor the model developed in the context of this work is an adequate description of the effects taking place during a gas chopping plasma etching process.

Lithography-free micro- and nanostructuring based on conventional plasma etching

In now-a-days semiconductor and MEMS technologies the photolithography is the working horse for fabrication of functional devices. The conventional way (so called Top-Down approach) of microstructuring starts with photolithography, followed by patterning the structures using etching, especially dry etching. The requirements for smaller and hence faster devices lead to decrease of the feature size to the range of several nanometers. However, the production of devices in this scale range needs photolithography equipment, which must overcome the diffraction limit. Therefore, new photolithography techniques have been recently developed, but they are rather expensive and restricted to plane surfaces. Recently a new route has been presented - so-called Bottom-Up approach - where from a single atom or a molecule it is possible to obtain functional devices. This creates new field - Nanotechnology - where one speaks about structures with dimensions 1 - 100 nm, and which has the possibility to replace the conventional photolithography concerning its integral part - the self-assembly. However, this technique requires additional and special equipment and therefore is not yet widely applicable. This work presents a general scheme for the fabrication of silicon and silicon dioxide structures with lateral dimensions of less than 100 nm that avoids high-resolution photolithography processes. For the self-aligned formation of extremely small openings in silicon dioxide layers at in depth sharpened surface structures, the angle dependent etching rate distribution of silicon dioxide against plasma etching with a fluorocarbon gas (CHF3) was exploited. Subsequent anisotropic plasma etching of the silicon substrate material through the perforated silicon dioxide masking layer results in high aspect ratio trenches of approximately the same lateral dimensions. The latter can be reduced and precisely adjusted between 0 and 200 nm by thermal oxidation of the silicon structures owing to the volume expansion of silicon during the oxidation. On the basis of this a technology for the fabrication of SNOM calibration standards is presented. Additionally so-formed trenches were used as a template for CVD deposition of diamond resulting in high aspect ratio diamond knife. A lithography-free method for production of periodic and nonperiodic surface structures using the angular dependence of the etching rate is also presented. It combines the self-assembly of masking particles with the conventional plasma etching techniques known from microelectromechanical system technology. The method is generally applicable to bulk as well as layered materials. In this work, layers of glass spheres of different diameters were assembled on the sample surface forming a mask against plasma etching. Silicon surface structures with periodicity of 500 nm and feature dimensions of 20 nm were produced in this way. Thermal oxidation of the so structured silicon substrate offers the capability to vary the fill factor of the periodic structure owing to the volume expansion during oxidation but also to define silicon dioxide surface structures by selective plasma etching. Similar structures can be simply obtained by structuring silicon dioxide layers on silicon. The method offers a simple route for bridging the Nano- and Microtechnology and moreover, an uncomplicated way for photonic crystal fabrication.

Wechselwirkung von im NANOJET erzeugten Teilchen mit Polymeren und biologischen Objekten

Am Institut für Mikrostrukturtechnologie und Analytik wurde eine neue Technik entwickelt, die neue Anwendungen und Methoden der Mikro- und Nanostrukturierung auf Basis eines neuen Verfahrens erschlossen hat. NANOJET führt über die passive Rastersondenmikroskopie hinaus zu einem vielseitigen, aktiven Bearbeitungswerkzeug auf der Mikro- und Nanometerskala. NANOJET (NANOstructuring Downstream PlasmaJET) ist eine aktive Rasterkraft-Mikroskopie-Sonde. Radikale (chemisch aktive Teilchen, die ein ungepaartes Valenzelektron besitzen) strömen aus dem Ende einer ultradünnen, hohlen Rasterkraftmikroskop-Spitze. Dadurch wird es möglich, über die übliche passive Abtastung einer Probenoberfläche hinausgehend, diese simultan und in-situ durch chemische Reaktionen zu verändern. Die Abtragung von Material wird durch eine chemische Ätzreaktion erreicht. In dieser Arbeit wurde zum größten Teil Photoresist als Substrat für die Ätzexperimente verwendet. Für das Ätzen des Resists wurden die Atome des Fluors und des Sauerstoffs im Grundzustand als verantwortlich identifiziert. Durch Experimente und durch Ergänzung von Literaturdaten wurde die Annahme bestätigt, dass Sauerstoffradikale mit Unterstützung von Fluorradikalen für die hohen erzielten Ätzraten verantwortlich sind. Die Beimischung von Fluor in einem Sauerstoffplasma führt zu einer Verringerung der Aktivierungsenergie für die Ätzreaktion gegenüber Verwendung reinen Sauerstoffs. In weiterer Folge wurde ein Strukturierungsverfahren dargestellt. Hierbei wurden "geformte Kapillaren" (mikrostrukturierte Aperturen) eingesetzt. Die Herstellung der Aperturen erfolgte durch einen elektrochemischen Ätzstop-Prozess. Die typische Größe der unter Verwendung der "geformten Kapillaren" geätzten Strukturen entsprach den Kapillarenöffnungen. Es wurde ein Monte-Carlo Simulationsprogramm entwickelt, welches den Transport der reaktiven Teilchen in der langen Transportröhre simulierte. Es wurde sowohl die Transmission der Teilchen in der Transportröhre und der Kapillare als auch ihre Winkelverteilung nach dem Verlassen der Kapillare berechnet. Das Aspektverhältnis der Röhren hat dabei einen sehr starken Einfluss. Mit einem steigenden Aspektverhältnis nahm die Transmission exponentiell ab. Die geschaffene experimentelle Infrastruktur wurde genutzt, um auch biologische Objekte zu behandeln und zu untersuchen. Hierfür wurde eine neue Methodik entwickelt, die eine dreidimensionale Darstellung des Zellinneren erlaubt. Dies wurde durch die kontrollierte Abtragung von Material aus der Zellmembran durchgeführt. Die Abtragung der Zellmembran erfolgte mittels Sauerstoffradikalen, die durch eine hohle Spitze lokalisiert zum Ort der Reaktion transportiert wurden. Ein piezoresistiver Cantilever diente als Sensor in dem zur Bildgebung eingesetzten RKM. Das entwickelte Verfahren ermöglicht es nun erstmals, schonend Zellen zu öffnen und die innen liegenden Organellen weiter zu untersuchen. Als Nachweis für weitere Verwendungsmöglichkeiten des NANOJET-Verfahrens wurde auch Knochenmaterial behandelt. Die Ergebnisse dieser Experimente zeigen klar, dass das Verfahren für vielfältige biologische Materialien verwendbar ist und somit nun ein weiter Anwendungskreis in der Biologie und Medizin offen steht.

Vesicle motion during sustained exocytosis in chromaffin cells

Chromaffin cells release catecholamines by exocytosis, a process that includes vesicle docking, priming and fusion. Although all these steps have been intensively studied, some aspects of their mechanisms, particularly those regarding vesicle transport to the active sites situated at the membrane, are still unclear. In this work, we show that it is possible to extract information on vesicle motion in Chromaffin cells from the combination of Langevin simulations and amperometric measurements. We developed a numerical model based on Langevin simulations of vesicle motion towards the cell membrane and on the statistical analysis of vesicle arrival times. We also performed amperometric experiments in bovine-adrenal Chromaffin cells under Ba2+ stimulation to capture neurotransmitter releases during sustained exocytosis. In the sustained phase, each amperometric peak can be related to a single release from a new vesicle arriving at the active site. The amperometric signal can then be mapped into a spike-series of release events. We normalized the spike-series resulting from the current peaks using a time-rescaling transformation, thus making signals coming from different cells comparable. We discuss why the obtained spike-series may contain information about the motion of all vesicles leading to release of catecholamines. We show that the release statistics in our experiments considerably deviate from Poisson processes. Moreover, the interspike-time probability is reasonably well described by two-parameter gamma distributions. In order to interpret this result we computed the vesicles’ arrival statistics from our Langevin simulations. As expected, assuming purely diffusive vesicle motion we obtain Poisson statistics. However, if we assume that all vesicles are guided toward the membrane by an attractive harmonic potential, simulations also lead to gamma distributions of the interspike-time probability, in remarkably good agreement with experiment. We also show that including the fusion-time statistics in our model does not produce any significant changes on the results. These findings indicate that the motion of the whole ensemble of vesicles towards the membrane is directed and reflected in the amperometric signals. Our results confirm the conclusions of previous imaging studies performed on single vesicles that vesicles’ motion underneath plasma membranes is not purely random, but biased towards the membrane.