Agroforestry systems of timber species and cacao: survival and growth during the early stages

In recent times, increased emphasis has been placed on diversifying the types of trees to shade cacao (Theobroma cacao L.) and to achieve additional services. Agroforestry systems that include profitable and native timber trees are a viable alternative but it is necessary to understand the growth characteristics of these species under different environmental conditions. Thus, timber tree species selection should be based on plant responses to biotic and abiotic factors. The aims of this study were (1) to evaluate growth rates and leaf area indices of the four commercial timber species: Cordia thaisiana, Cedrela odorata, Swietenia macrophylla and Tabebuia rosea in conjunction with incidence of insect attacks and (2) to compare growth rates of four Venezuelan Criollo cacao cultivars planted under the shade of these four timber species during the first 36 months after establishment. Parameters monitored in timber trees were: survival rates, growth rates expressed as height and diameter at breast height and leaf area index. In the four Cacao cultivars: height and basal diameter. C. thaisiana and C. odorata had the fastest growth and the highest survival rates. Growth rates of timber trees will depend on their susceptibility to insect attacks as well as to total leaf area. All cacao cultivars showed higher growth rates under the shade of C. odorata. Growth rates of timber trees and cacao cultivars suggest that combinations of cacao and timber trees are a feasible agroforestry strategy in Venezuela.

Effect of within-litter birth weight variation on piglet survival and pre-weaning weight gain in a commercial herd

There are several factors that affect piglet survival and this has a bearing on sow productivity. Ten variables that influence pre-weaning vitality were analysed using records from the Pig Industry Board, Zimbabwe. These included individual piglet birth weight, piglet origin (nursed in original litter or fostered), sex, relative birth weight expressed as standard deviation units, sow parity, total number of piglets born, year and month of farrowing, within-litter variability and the presence of stillborn or mummified littermates. The main factors that influenced piglet mortality were fostering, parity and within-litter variability especially the weight of the individual piglet relative to the average of the litter (P<0.05). Presence of a mummified or stillborn littermate, which could be a proxy for unfavourable uterine environment or trauma during the birth process, did not influence pre-weaning mortality. Variability within a litter and the deviation of the weight of an individual piglet from the litter mean, influenced survival to weaning. It is, therefore, advisable for breeders to include uniformity within the litter as a selection criterion. The recording of various variables by farmers seems to be a useful management practice to identify piglets at risk so as to establish palliative measures. Further, farmers should know which litters and which piglets within a litter are at risk and require more attention.

Lithography-free micro- and nanostructuring based on conventional plasma etching

In now-a-days semiconductor and MEMS technologies the photolithography is the working horse for fabrication of functional devices. The conventional way (so called Top-Down approach) of microstructuring starts with photolithography, followed by patterning the structures using etching, especially dry etching. The requirements for smaller and hence faster devices lead to decrease of the feature size to the range of several nanometers. However, the production of devices in this scale range needs photolithography equipment, which must overcome the diffraction limit. Therefore, new photolithography techniques have been recently developed, but they are rather expensive and restricted to plane surfaces. Recently a new route has been presented - so-called Bottom-Up approach - where from a single atom or a molecule it is possible to obtain functional devices. This creates new field - Nanotechnology - where one speaks about structures with dimensions 1 - 100 nm, and which has the possibility to replace the conventional photolithography concerning its integral part - the self-assembly. However, this technique requires additional and special equipment and therefore is not yet widely applicable. This work presents a general scheme for the fabrication of silicon and silicon dioxide structures with lateral dimensions of less than 100 nm that avoids high-resolution photolithography processes. For the self-aligned formation of extremely small openings in silicon dioxide layers at in depth sharpened surface structures, the angle dependent etching rate distribution of silicon dioxide against plasma etching with a fluorocarbon gas (CHF3) was exploited. Subsequent anisotropic plasma etching of the silicon substrate material through the perforated silicon dioxide masking layer results in high aspect ratio trenches of approximately the same lateral dimensions. The latter can be reduced and precisely adjusted between 0 and 200 nm by thermal oxidation of the silicon structures owing to the volume expansion of silicon during the oxidation. On the basis of this a technology for the fabrication of SNOM calibration standards is presented. Additionally so-formed trenches were used as a template for CVD deposition of diamond resulting in high aspect ratio diamond knife. A lithography-free method for production of periodic and nonperiodic surface structures using the angular dependence of the etching rate is also presented. It combines the self-assembly of masking particles with the conventional plasma etching techniques known from microelectromechanical system technology. The method is generally applicable to bulk as well as layered materials. In this work, layers of glass spheres of different diameters were assembled on the sample surface forming a mask against plasma etching. Silicon surface structures with periodicity of 500 nm and feature dimensions of 20 nm were produced in this way. Thermal oxidation of the so structured silicon substrate offers the capability to vary the fill factor of the periodic structure owing to the volume expansion during oxidation but also to define silicon dioxide surface structures by selective plasma etching. Similar structures can be simply obtained by structuring silicon dioxide layers on silicon. The method offers a simple route for bridging the Nano- and Microtechnology and moreover, an uncomplicated way for photonic crystal fabrication.