Low-Cost Micromechanically Tunable Optical Devices: Strained Resonator Engineering, Technological Implementation and Characterization

The rapid growth of the optical communication branches and the enormous demand for more bandwidth require novel networks such as dense wavelength division multiplexing (DWDM). These networks enable higher bitrate transmission using the existing optical fibers. Micromechanically tunable optical microcavity devices like VCSELs, Fabry-Pérot filters and photodetectors are core components of these novel DWDM systems. Several air-gap based tunable devices were successfully implemented in the last years. Even though these concepts are very promising, two main disadvantages are still remaining. On the one hand, the high fabrication and integration cost and on the other hand the undesired adverse buckling of the suspended membranes. This thesis addresses these two problems and consists of two main parts: • PECVD dielectric material investigation and stress control resulting in membranes shape engineering. • Implementation and characterization of novel tunable optical devices with tailored shapes of the suspended membranes. For this purposes, low-cost PECVD technology is investigated and developed in detail. The macro- and microstress of silicon nitride and silicon dioxide are controlled over a wide range. Furthermore, the effect of stress on the optical and mechanical properties of the suspended membranes and on the microcavities is evaluated. Various membrane shapes (concave, convex and planar) with several radii of curvature are fabricated. Using this resonator shape engineering, microcavity devices such as non tunable and tunable Fabry-Pérot filters, VCSELs and PIN photodetectors are succesfully implemented. The fabricated Fabry-Pérot filters cover a spectral range of over 200nm and show resonance linewidths down to 1.5nm. By varying the stress distribution across the vertical direction within a DBR, the shape and the radius of curvature of the top membrane are explicitely tailored. By adjusting the incoming light beam waist to the curvature, the fundamental resonant mode is supported and the higher order ones are suppressed. For instance, a tunable VCSEL with 26 nm tuning range, 400µW maximal output power, 47nm free spectral range and over 57dB side mode suppresion ratio (SMSR) is demonstrated. Other technologies, such as introducing light emitting organic materials in microcavities are also investigated.

Lithography-free micro- and nanostructuring based on conventional plasma etching

In now-a-days semiconductor and MEMS technologies the photolithography is the working horse for fabrication of functional devices. The conventional way (so called Top-Down approach) of microstructuring starts with photolithography, followed by patterning the structures using etching, especially dry etching. The requirements for smaller and hence faster devices lead to decrease of the feature size to the range of several nanometers. However, the production of devices in this scale range needs photolithography equipment, which must overcome the diffraction limit. Therefore, new photolithography techniques have been recently developed, but they are rather expensive and restricted to plane surfaces. Recently a new route has been presented - so-called Bottom-Up approach - where from a single atom or a molecule it is possible to obtain functional devices. This creates new field - Nanotechnology - where one speaks about structures with dimensions 1 - 100 nm, and which has the possibility to replace the conventional photolithography concerning its integral part - the self-assembly. However, this technique requires additional and special equipment and therefore is not yet widely applicable. This work presents a general scheme for the fabrication of silicon and silicon dioxide structures with lateral dimensions of less than 100 nm that avoids high-resolution photolithography processes. For the self-aligned formation of extremely small openings in silicon dioxide layers at in depth sharpened surface structures, the angle dependent etching rate distribution of silicon dioxide against plasma etching with a fluorocarbon gas (CHF3) was exploited. Subsequent anisotropic plasma etching of the silicon substrate material through the perforated silicon dioxide masking layer results in high aspect ratio trenches of approximately the same lateral dimensions. The latter can be reduced and precisely adjusted between 0 and 200 nm by thermal oxidation of the silicon structures owing to the volume expansion of silicon during the oxidation. On the basis of this a technology for the fabrication of SNOM calibration standards is presented. Additionally so-formed trenches were used as a template for CVD deposition of diamond resulting in high aspect ratio diamond knife. A lithography-free method for production of periodic and nonperiodic surface structures using the angular dependence of the etching rate is also presented. It combines the self-assembly of masking particles with the conventional plasma etching techniques known from microelectromechanical system technology. The method is generally applicable to bulk as well as layered materials. In this work, layers of glass spheres of different diameters were assembled on the sample surface forming a mask against plasma etching. Silicon surface structures with periodicity of 500 nm and feature dimensions of 20 nm were produced in this way. Thermal oxidation of the so structured silicon substrate offers the capability to vary the fill factor of the periodic structure owing to the volume expansion during oxidation but also to define silicon dioxide surface structures by selective plasma etching. Similar structures can be simply obtained by structuring silicon dioxide layers on silicon. The method offers a simple route for bridging the Nano- and Microtechnology and moreover, an uncomplicated way for photonic crystal fabrication.

Fabrication of diamond nanostructures and investigation of the imbedded NV centers

Diamant ist ein Material mit vielen außerordentlichen Eigenschaften, die ihn zu einem äußerst vielversprechenden Kandidaten für Anwendungen in Wissen-schaft und Technik machen. In den letzten Jahren wurde Diamant häufig als einzigartige Plattform für neue Anwendungen beispielsweise in der Quanteninformationstechnologie (QIT) oder in der Magnetometrie im Nanometermaßstab eingesetzt, wobei einer der wichtigsten lumineszierenden Gitterdefekte im Diamantgitter eingesetzt wird. Dabei handelt es sich um die sogenannten Stickstoff/Fehlenstellen-Farbzentren (NV-Zentren), die im sichtbaren Bereich mit einer absoluten Photostabilität bei Raumtemperatur emittieren. In dieser Arbeit wurden NV-Zentren in Diamantnanokristalliten und –nanosäulen untersucht, die während des Wachstumsprozesses erzeugt wurden. Einzelne Diamantnanokristallite und nanokristalline Diamantschichten (NCD), aus denen Nanosäulen geätzt wurden, wurden mithilfe der Hot Filament Chemical Vapour Deposition (HFCVD) abgeschieden. Zu Vergleichszwecken wurden auch ultrananokristalline Diamantschichten (UNCD) mittels Mikrowellen-CVD (MWCVD) hergestellt. Die Filme wurden sorgfältig in Bezug auf ihre Morphologie, kristallinen Eigenschaften und Zusammensetzung untersucht. Um die Möglichkeit einer Integration dieser Diamantschichten mit temperaturempfindlichen Materialien wie III/V-Halbleitern, Metallen mit niedrigem Schmelzpunkt oder Polymeren zu untersuchen, wurde der Einfluss der Substrattemperatur ermittelt. Eindimensionale NCD- und UNCD-Diamantnanostrukturen wurden mithilfe der Elektronenstrahllithographie (EBL) und reaktivem Ionenätzen in einem induktiv gekoppelten O2-Plasma (ICP-RIE) hergestellt. Zur Vorbereitung wurden zunächst die Ätzraten in Abhängigkeit von den vier wichtigsten Parametern ermittelt. Weitere Erkenntnisse über die Ätzmechanismen wurden durch Ätzexperiment mit unstrukturierten NCD- und UNCD-Schichten erhalten Mittels der EBL konnten mithilfe von Gold-Ätzmasken Nanosäulen mit Durchmessern von 50 nm bis zu 1 μm hergestellt werden.Eine optische Charakterisierung der NCD- und UNCD-Nanosäulen erfolgte mithilfe von Fluorenzenz-Mapping und Photomumineszenz-Spektroskopie. Diese Messungen ergaben, dass in beiden Arten von Säulen NV-Zentren vorhanden sind. Allerdings wurden nur in NCD-Säulen die gewünschten NV--Zentren gefunden, in UNCD-Säulen hingegen nur NV0-Zentren.