A Framework for TEI-Based Scholarly Text Editions

In this paper, we describe an interdisciplinary project in which visualization techniques were developed for and applied to scholarly work from literary studies. The aim was to bring Christof Schöch's electronic edition of Bérardier de Bataut's Essai sur le récit (1776) to the web. This edition is based on the Text Encoding Initiative's XML-based encoding scheme (TEI P5, subset TEI-Lite). This now de facto standard applies to machine-readable texts used chiefly in the humanities and social sciences. The intention of this edition is to make the edited text freely available on the web, to allow for alternative text views (here original and modern/corrected text), to ensure reader-friendly annotation and navigation, to permit on-line collaboration in encoding and annotation as well as user comments, all in an open source, generically usable, lightweight package. These aims were attained by relying on a GPL-based, public domain CMS (Drupal) and combining it with XSL-Stylesheets and Java Script.

Lithography-free micro- and nanostructuring based on conventional plasma etching

In now-a-days semiconductor and MEMS technologies the photolithography is the working horse for fabrication of functional devices. The conventional way (so called Top-Down approach) of microstructuring starts with photolithography, followed by patterning the structures using etching, especially dry etching. The requirements for smaller and hence faster devices lead to decrease of the feature size to the range of several nanometers. However, the production of devices in this scale range needs photolithography equipment, which must overcome the diffraction limit. Therefore, new photolithography techniques have been recently developed, but they are rather expensive and restricted to plane surfaces. Recently a new route has been presented - so-called Bottom-Up approach - where from a single atom or a molecule it is possible to obtain functional devices. This creates new field - Nanotechnology - where one speaks about structures with dimensions 1 - 100 nm, and which has the possibility to replace the conventional photolithography concerning its integral part - the self-assembly. However, this technique requires additional and special equipment and therefore is not yet widely applicable. This work presents a general scheme for the fabrication of silicon and silicon dioxide structures with lateral dimensions of less than 100 nm that avoids high-resolution photolithography processes. For the self-aligned formation of extremely small openings in silicon dioxide layers at in depth sharpened surface structures, the angle dependent etching rate distribution of silicon dioxide against plasma etching with a fluorocarbon gas (CHF3) was exploited. Subsequent anisotropic plasma etching of the silicon substrate material through the perforated silicon dioxide masking layer results in high aspect ratio trenches of approximately the same lateral dimensions. The latter can be reduced and precisely adjusted between 0 and 200 nm by thermal oxidation of the silicon structures owing to the volume expansion of silicon during the oxidation. On the basis of this a technology for the fabrication of SNOM calibration standards is presented. Additionally so-formed trenches were used as a template for CVD deposition of diamond resulting in high aspect ratio diamond knife. A lithography-free method for production of periodic and nonperiodic surface structures using the angular dependence of the etching rate is also presented. It combines the self-assembly of masking particles with the conventional plasma etching techniques known from microelectromechanical system technology. The method is generally applicable to bulk as well as layered materials. In this work, layers of glass spheres of different diameters were assembled on the sample surface forming a mask against plasma etching. Silicon surface structures with periodicity of 500 nm and feature dimensions of 20 nm were produced in this way. Thermal oxidation of the so structured silicon substrate offers the capability to vary the fill factor of the periodic structure owing to the volume expansion during oxidation but also to define silicon dioxide surface structures by selective plasma etching. Similar structures can be simply obtained by structuring silicon dioxide layers on silicon. The method offers a simple route for bridging the Nano- and Microtechnology and moreover, an uncomplicated way for photonic crystal fabrication.

Comparison of different methods in estimating potential evapotranspiration at Muda Irrigation Scheme of Malaysia

Evapotranspiration (ET) is a complex process in the hydrological cycle that influences the quantity of runoff and thus the irrigation water requirements. Numerous methods have been developed to estimate potential evapotranspiration (PET). Unfortunately, most of the reliable PET methods are parameter rich models and therefore, not feasible for application in data scarce regions. On the other hand, accuracy and reliability of simple PET models vary widely according to regional climate conditions. The objective of the present study was to evaluate the performance of three temperature-based and three radiation-based simple ET methods in estimating historical ET and projecting future ET at Muda Irrigation Scheme at Kedah, Malaysia. The performance was measured by comparing those methods with the parameter intensive Penman-Monteith Method. It was found that radiation based methods gave better performance compared to temperature-based methods in estimation of ET in the study area. Future ET simulated from projected climate data obtained through statistical downscaling technique also showed that radiation-based methods can project closer ET values to that projected by Penman-Monteith Method. It is expected that the study will guide in selecting suitable methods for estimating and projecting ET in accordance to availability of meteorological data.