Code clones in program test sequence identification

Code clones are portions of source code which are similar to the original program code. The presence of code clones is considered as a bad feature of software as the maintenance of software becomes difficult due to the presence of code clones. Methods for code clone detection have gained immense significance in the last few years as they play a significant role in engineering applications such as analysis of program code, program understanding, plagiarism detection, error detection, code compaction and many more similar tasks. Despite of all these facts, several features of code clones if properly utilized can make software development process easier. In this work, we have pointed out such a feature of code clones which highlight the relevance of code clones in test sequence identification. Here program slicing is used in code clone detection. In addition, a classification of code clones is presented and the benefit of using program slicing in code clone detection is also mentioned in this work.

Microwave Plasma Assisted ALD Development for the Deposition of Gate Oxides & ALD of High-k Dielectrics

The semiconductor industry's urge towards faster, smaller and cheaper integrated circuits has lead the industry to smaller node devices. The integrated circuits that are now under volume production belong to 22 nm and 14 nm technology nodes. In 2007 the 45 nm technology came with the revolutionary high- /metal gate structure. 22 nm technology utilizes fully depleted tri-gate transistor structure. The 14 nm technology is a continuation of the 22 nm technology. Intel is using second generation tri-gate technology in 14 nm devices. After 14 nm, the semiconductor industry is expected to continue the scaling with 10 nm devices followed by 7 nm. Recently, IBM has announced successful production of 7 nm node test chips. This is the fashion how nanoelectronics industry is proceeding with its scaling trend. For the present node of technologies selective deposition and selective removal of the materials are required. Atomic layer deposition and the atomic layer etching are the respective techniques used for selective deposition and selective removal. Atomic layer deposition still remains as a futuristic manufacturing approach that deposits materials and lms in exact places. In addition to the nano/microelectronics industry, ALD is also widening its application areas and acceptance. The usage of ALD equipments in industry exhibits a diversi cation trend. With this trend, large area, batch processing, particle ALD and plasma enhanced like ALD equipments are becoming prominent in industrial applications. In this work, the development of an atomic layer deposition tool with microwave plasma capability is described, which is a ordable even for lightly funded research labs.