3 resultados para Federal High Performance Computing Program (U.S.)

em Cochin University of Science


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Decimal multiplication is an integral part of financial, commercial, and internet-based computations. This paper presents a novel double digit decimal multiplication (DDDM) technique that offers low latency and high throughput. This design performs two digit multiplications simultaneously in one clock cycle. Double digit fixed point decimal multipliers for 7digit, 16 digit and 34 digit are simulated using Leonardo Spectrum from Mentor Graphics Corporation using ASIC Library. The paper also presents area and delay comparisons for these fixed point multipliers on Xilinx, Altera, Actel and Quick logic FPGAs. This multiplier design can be extended to support decimal floating point multiplication for IEEE 754- 2008 standard.

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The thesis focuses on efficient design methods and reconfiguration architectures suitable for higher performance wireless communication .The work presented in this thesis describes the development of compact,inexpensive and low power communication devices that are robust,testable and capable of handling multiple communication standards.A new multistandard Decimation Filter Design Toolbox is developed in MATLAB GUIDE environment.RNS based dual-mode decimation filters reconfigurable for WCDMA/WiMAX and WCDMA/WLANa standards are designed and implemented.It offers high speed operation with lesser area requirement and lower dynamic power dissipation.A novel sigma-delta based direct analog-to-residue converter that reduces the complexity of RNS conversion circuitry is presented.The performance of an OFDM communication system with a new RRNS-convolutional concatenated coding is analysed and improved BER performance is obtained under different channel conditions. Easily testable MAC units for filters are presented using Reed-Muller logic for realization.

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Graphene has captured the attention of scientific community due to recently emerging high performance applications. Hence, studying its reinforcing effects on epoxy resin is a significant step. In this study, microwave exfoliated reduced graphene oxide (MERGO) was prepared from natural graphite for subsequent fabrication of epoxy nanocomposites using triethylenetetramine (TETA) as a curing agent via insitu polymerization. Thermogravimetric analysis (TGA), X-ray diffraction (XRD), Raman spectroscopy, Fourier transform infrared spectroscopy (FTIR), C13 NMR spectroscopy, X-ray photoelectron spectroscopy (XPS) and ultravioletevisible (UVevis) spectroscopy were employed to confirm the simultaneous reduction and exfoliation of graphene oxide. The reinforcing effect of MERGO on epoxy resin was explored by investigating its static mechanical properties and dynamic mechanical analysis (DMA) at MERGO loadings of 0 to 0.5 phr. The micro-structure of epoxy/MERGO nanocomposites was investigated using scanning electron microscope (SEM), transmission electron microscope (TEM) and XRD techniques. The present work reports an enhancement of 32%, 103% and 85% in tensile, impact and flexural strength respectively of epoxy by the addition of even 0.25 phr MERGO. At this loading elastic and flexural moduli also increased by 10% and 65%, respectively. Single-edge-notch three-point-Bending (SEN-TPB) fracture toughness (KIC) measurements were carried out where a 63% increase was observed by the introduction of 0.25 phr MERGO. The interfacial interactions brought about by graphene also benefited the dynamic mechanical properties to a large extent in the form of a significant enhancement in storage modulus and slightly improved glass transition temperature. Considerable improvements were also detected in dielectric properties. The epoxy nanocomposite also attained an ac conductivity of 10 5 S/m and a remarkable increase in dielectric constant. The simple and cost effective way of graphene synthesis for the fabrication of epoxy/MERGO nanocomposites may be extended to the preparation of other MERGO based polymer nanocomposites. This remarkable class of materials has thrown open enormous opportunities for developing conductive adhesives and in microelectronics