9 resultados para Etch adhesives

em Cochin University of Science


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Rubber solutions were prepared and used for bonding wood pieces. The effect of the variation of chlorinated natural rubber (CNR) and phenolformaldehyde (PF) resin in the adhesive solutions on lap shear strength was determined. Natural rubber and neoprene-based adhesive solutions were compared for their lap shear strength. The storage stability of the adhesive prepared was determined. The change in lap shear strength before and after being placed in cold water, hot water, acid, and alkali was tested. The bonding character of these adhesives was compared with different commercially available solution adhesives. The room-temperature aging resistance of wood joints was also determined. In all the studies, the adhesive prepared in the laboratory was found to be superior compared to the commercial adhesives.

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The primary objective of this investigation has been to develop more efficient and low cost adhesives for bonding various elastomer combinations particularly NR to NR, NR/PB to NR/PB, CR to CR,NR to CR and NR to NBR.A significant achievement of the investigation was the development of solventless and environment friendly solid adhesives for NR to NR and NR/PB to NR/PB particularly for precured retreading. Conventionally used adhesives in this area are mostly NR based adhesive strips in the presence of a dough. The study has shown that an ultra accelerator could be added to the dough just before applying it on the tire which can significantly bring down the retreading time resulting in prolonged tire service and lower energy consumption. Further latex reclaim has been used for the preparation of the solid strip which can reduce the cost considerably.Another significant finding was that by making proper selection of the RF resin, the efficiency and shelflife of the RFL adhesive used for nylon and rayon tire cord dipping can be improved. In the conventionally used RFL adhesive, the resin once prepared has to be added to the latex within 30 minutes and the RFL has to be used after 4 hours maturation time maximum shelf life of the RFL dip solution being 72 hours. In this study a formaldehyde deficient resin was used and hence more flexibility was available for mixing with latex and maturing. It also has a much longer shelf life. In the method suggested in this study, formaldehyde donors were added only in the rubber compound to make up the formaldehyde deficiency in the RFL. The results of this investigation show that the pull through load by employing this method and the conventional method are comparable. This study has also shown that the amount of RF resin with RFL adhesive can be partially replaced by other modifying agents for cost reduction.Cashew nut shell liquid (CNSL) resin can be employed for improving the bonding of dipped nylon and rayon cord with NR.Since CNSL resin cannot be added in the dip solution since it is not soluble in water, it was added in the rubber compound. The amount of wood rosin in the rubber compound can be reduced by using CNSL resin.Another interesting result of the investigation was the use of CR based adhesive modified with chlorinated natural rubber for CR to CR bonding. Addition of chlorinated natural rubber was found to improve sea water resistance of CR based adhesive. In the bonding of a polar rubber like nitrile rubber or polychloroprene rubber to a non polar rubber like natural rubber, an adhesive based on polychloroprene rubber was found to be effective.

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Novel latex based and solution based adhesives were prepared and evaluated for wood to wood bonding.These adhesive were found to be superior to commercical adhesives like fevicol and dentrite.Novel adhesives were prepared for leather to leather bonding and these were also found to be more efficientt than the polyurethane type and dentrite adhesives used commercially.A novel strip adhesive system employing very low amount of solvents was tried successfully for rubber-to-metal bonding.Further ,a novel adhesive system was investigated successfully for bonding copper coated bead wire and steel cord to rubber by modifying it with chloroprene rubber.

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ABSTRACT: Nylon tire cord (1680/2) was dipped in different adhesives based on resorcinol formaldehyde resin and latex (RFL) and was bonded to natural rubber-based compounds. The resin-rubber ratio in the RFL adhesive was optimized. The variation of pull-through load was studied by varying the drying and curing temperature of the dipped nylon tire cord. RFL adhesive based on vinylpyridine latex was found to have better rubber-to-nylon tire cord bonding, compared with the one based on natural rubber latex. Addition of a formaldehyde donor into the RFL adhesive/rubber compound improves adhesion.

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The aim of the investigation is to develop new high performance adhesive systems based on neoprene-phenolic blends. Initially the effect of addition of all possible ingredients like fillers, adhesion promoters, curing agents and their optimum compositions to neoprene solution is investigated. The phenolic resin used is a copolymer of phenol-cardanolformaldehyde prepared in the laboratory. The optimum ratio between phenol and cardanol that gives the maximum bond strength in metal-metal, rubber-rubber and rubber-metal specimens has been identified. Further the ratio between total phenols and formaldehyde is also optimised. The above adhesive system is further modified by the addition of epoxidized phenolic novolacs. For this purpose, phenolic novolac resins are prepared in different stoichiometric ratios and are subsequently epoxidized. The effectiveness of the adhesive for bonding different metal and rubber substrates is another part of the study. To study the ageing behaviour, different bonded specimens are exposed to high temperature, hot water and salt water and adhesive properties have been evaluated. The synthesized resins have been characterized by FTIR , HNMR spectroscopy. The molecular weights of the resins have been obtained by GPC. Thermogravimetric analysis and differential scanning calorimetry are used to study the thermal properties. The fractured surface analysis is studied by scanning electron microscopy. The study has brought to light the influence of phenol/ formaldehyde stoichiometric ratio, addition of cardanol (a renewable resource), adhesion promoters and suitability of the adhesive for different substrates and the age resistance of adhesive joints among other things.

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This research project aims at developing new applications for CNSL in the polymer field. Cashew nut shell liquid (CNSL) is a cheap agro-byproduct and renewable resource which consists mainly of substituted phenols. By using CNSL in place of phenol, phenol derived from petrochemicals can be conserved and a cheap agro-byproduct utilized.In this study CNSL based resin is prepared by condensing a mixture of phenol and CNSL with hexamethylenetetramine and the effect of P: F ratio and CNSL: P ratio on the properties of synthesized resin is studied. The adhesive properties of CNSL based resin in combination with neoprene rubber are investigated. The effect of varying the stoichiometric ratios between total phenol and formaldehyde and CNSL and phenol of the resin, resin content, choice and extent of fillers and adhesion promoters in the adhesive formulation are studied. The effect of resin on the ageing properties of various elastomers is also studied by following changes in tensile strength, elongation at break, modulus, tear strength, swelling index and acetone soluble matter. Crude CNSL and resins with different P: F ratios and CNSL: P ratios are incorporated into elastomers. Lastly, utility of CNSL based resin as binder for making particleboard is investigated.The results show that CNSL based resin is an effective ingredient in adhesives for bonding aluminium to aluminium. The resin used for adhesive fonnulation gives the best performance at 45 to 55 phr resin and a total phenol: formaldehyde of l:2.9. The resin when added at a rate of l5 phr improves ageing characteristics of elastomers with respect to mechanical properties. The reaction mixture of CNSL and hexa and the resin resulting from the condensation of CN SL, phenol and hexa can be used as effective binders for moulding particleboard.

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The thesis presents the results of the investigations on the crystallisation ‘behaviour, detect structure end electrical properties of certain organic crystals---phthslic snhydride end potsssiun scid phthalate Hollow crystals of phthalic snhydride were grown from vapour. the norpholog of these hollow crystals were studied in detail and s. mechanism for their growth has been proposed. A closed crystal—vapour system was used to study the basal plane growth of the whiskers and the sequential growth, observed, confirmed the mechanism suggested for hollow crystals. The dendritic crystals of phthslic enhydride were grown, both iron the melt and solution. The observed morphologies of these dendrites ere described. Bpherulites of phthalic anhydride have been grown by the artificial initiation of nucleation, from melt and solution. The variation of the substructure oi’ these spherulites with the growth tenperature wee investigated. The spherulitic filll having ribbon substructure were etched to reveal dislocations. A mechanism for the formation of the observed etch pattern has been suggested. the slip occurring in these ribbons were studied and the results are presented

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Graphene has captured the attention of scientific community due to recently emerging high performance applications. Hence, studying its reinforcing effects on epoxy resin is a significant step. In this study, microwave exfoliated reduced graphene oxide (MERGO) was prepared from natural graphite for subsequent fabrication of epoxy nanocomposites using triethylenetetramine (TETA) as a curing agent via insitu polymerization. Thermogravimetric analysis (TGA), X-ray diffraction (XRD), Raman spectroscopy, Fourier transform infrared spectroscopy (FTIR), C13 NMR spectroscopy, X-ray photoelectron spectroscopy (XPS) and ultravioletevisible (UVevis) spectroscopy were employed to confirm the simultaneous reduction and exfoliation of graphene oxide. The reinforcing effect of MERGO on epoxy resin was explored by investigating its static mechanical properties and dynamic mechanical analysis (DMA) at MERGO loadings of 0 to 0.5 phr. The micro-structure of epoxy/MERGO nanocomposites was investigated using scanning electron microscope (SEM), transmission electron microscope (TEM) and XRD techniques. The present work reports an enhancement of 32%, 103% and 85% in tensile, impact and flexural strength respectively of epoxy by the addition of even 0.25 phr MERGO. At this loading elastic and flexural moduli also increased by 10% and 65%, respectively. Single-edge-notch three-point-Bending (SEN-TPB) fracture toughness (KIC) measurements were carried out where a 63% increase was observed by the introduction of 0.25 phr MERGO. The interfacial interactions brought about by graphene also benefited the dynamic mechanical properties to a large extent in the form of a significant enhancement in storage modulus and slightly improved glass transition temperature. Considerable improvements were also detected in dielectric properties. The epoxy nanocomposite also attained an ac conductivity of 10 5 S/m and a remarkable increase in dielectric constant. The simple and cost effective way of graphene synthesis for the fabrication of epoxy/MERGO nanocomposites may be extended to the preparation of other MERGO based polymer nanocomposites. This remarkable class of materials has thrown open enormous opportunities for developing conductive adhesives and in microelectronics

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Polymers with conjugated π-electron backbone display unusual electronic properties such as low energy optical transition, low ionization potentials, and high electron affinities. The properties that make these materials attractive include a wide range of electrical conductivity, mechanical flexibility and thermal stability. Some of the potential applications of these conjugated polymers are in sensors, solar cells, field effect transistors, field emission and electrochromic displays, supercapacitors and energy storage. With recent advances in the stability of conjugated polymer materials, and improved control of properties, a growing number of applications are currently being explored. Some of the important applications of conducting polymers include: they are used in electrostatic materials, conducting adhesives, shielding against electromagnetic interference (EMI), artificial nerves, aircraft structures, diodes, and transistors.