Epoxy-modiWed, unsaturated polyester hybrid networks

Hybrid polymer networks (HPNs) based on unsaturated polyester resin (UPR) and epoxy resins were synthesized by reactive blending. The epoxy resins used were epoxidised phenolic novolac (EPN), epoxidised cresol novolac (ECN) and diglycidyl ether of bisphenol A (DGEBA). Epoxy novolacs were prepared by glycidylation of the novolacs using epichlorohydrin. The physical, mechanical, and thermal properties of the cured blends were compared with those of the control resin. Epoxy resins show good miscibility and compatibility with the UPR resin on blending and the co-cured resin showed substantial improvement in the toughness and impact resistance. Considerable enhancement of tensile strength and toughness are noticed at very low loading of EPN. Thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA) and diVerential scanning calorimetry (DSC) were employed to study the thermal properties of the toughened resin. The EPN/ UPR blends showed substantial improvement in thermal stability as evident from TGA and damping data. The fracture behaviour was corroborated by scanning electron microscopy (SEM). The performance of EPN is found to be superior to other epoxy resins

Epoxidized Phenolic Novolac: A Novel Modifier for Unsaturated Polyester Resin

Unsaturated polyester resins (UPRs) are used widely in the fiber-reinforced plastics (FRPs) industry. These resins have the disadvantages of brittleness and poor resistance to crack propagation. In this study, hybrid polymer networks (HPNs) based on UPR and epoxidized phenolic novolacs (EPNs) were prepared by reactive blending. A HPN is composed of a backbone polymer containing two types of reactive groups that can take part in crosslinking reactions via different mechanisms. EPNs were prepared by glycidylation of novolacs using epichlorohydrin. The novolacs had varying phenol: formaldehyde ratios. Blends of unsaturated polyester with EPN were then prepared. The physical properties of the cured blends were compared with those of the control resin. EPN shows good miscibility and compatibility with the resin and improves the toughness and impact resistance substantially. Considerable enhancement of tensile strength is also noticed at about 5% by weight of epoxidized novolac resin. TGA, DMA, and DSC were used to study the thermal properties of the toughened resin and the fracture behavior was studied using SEM. The blends are also found to have better thermal stability. Blending with EPN can be a useful and cost-effective technique for modification of UPR

Rice husk ash – A valuable reinforcement for high density polyethylene

This paper presents the results of a study on the use of rice husk ash (RHA) for property modification of high density polyethylene (HDPE). Rice husk is a waste product of the rice processing industry. It is used widely as a fuel which results in large quantities of RHA. Here, the characterization of RHA has been done with the help of X-ray diffraction (XRD), Inductively Coupled Plasma Atomic Emission Spectroscopy (ICPAES), light scattering based particle size analysis, Fourier transform infrared spectroscopy (FTIR) and Scanning Electron Microscope (SEM). Most reports suggest that RHA when blended directly with polymers without polar groups does not improve the properties of the polymer substantially. In this study RHA is blended with HDPE in the presence of a compatibilizer. The compatibilized HDPE-RHA blend has a tensile strength about 18% higher than that of virgin HDPE. The elongation-at-break is also higher for the compatibilized blend. TGA studies reveal that uncompatibilized as well as compatibilized HDPERHA composites have excellent thermal stability. The results prove that RHA is a valuable reinforcing material for HDPE and the environmental pollution arising from RHA can be eliminated in a profitable way by this technique.

Microwave exfoliated reduced graphene oxide epoxy nanocomposites for high performance applications

Graphene has captured the attention of scientific community due to recently emerging high performance applications. Hence, studying its reinforcing effects on epoxy resin is a significant step. In this study, microwave exfoliated reduced graphene oxide (MERGO) was prepared from natural graphite for subsequent fabrication of epoxy nanocomposites using triethylenetetramine (TETA) as a curing agent via insitu polymerization. Thermogravimetric analysis (TGA), X-ray diffraction (XRD), Raman spectroscopy, Fourier transform infrared spectroscopy (FTIR), C13 NMR spectroscopy, X-ray photoelectron spectroscopy (XPS) and ultravioletevisible (UVevis) spectroscopy were employed to confirm the simultaneous reduction and exfoliation of graphene oxide. The reinforcing effect of MERGO on epoxy resin was explored by investigating its static mechanical properties and dynamic mechanical analysis (DMA) at MERGO loadings of 0 to 0.5 phr. The micro-structure of epoxy/MERGO nanocomposites was investigated using scanning electron microscope (SEM), transmission electron microscope (TEM) and XRD techniques. The present work reports an enhancement of 32%, 103% and 85% in tensile, impact and flexural strength respectively of epoxy by the addition of even 0.25 phr MERGO. At this loading elastic and flexural moduli also increased by 10% and 65%, respectively. Single-edge-notch three-point-Bending (SEN-TPB) fracture toughness (KIC) measurements were carried out where a 63% increase was observed by the introduction of 0.25 phr MERGO. The interfacial interactions brought about by graphene also benefited the dynamic mechanical properties to a large extent in the form of a significant enhancement in storage modulus and slightly improved glass transition temperature. Considerable improvements were also detected in dielectric properties. The epoxy nanocomposite also attained an ac conductivity of 10 5 S/m and a remarkable increase in dielectric constant. The simple and cost effective way of graphene synthesis for the fabrication of epoxy/MERGO nanocomposites may be extended to the preparation of other MERGO based polymer nanocomposites. This remarkable class of materials has thrown open enormous opportunities for developing conductive adhesives and in microelectronics