Instrumentation and software for the VERITAS Project and the detection of TeV Gamma-Ray Emission from the BL Lacertae Object 1ES1959+650

Transmission of Cherenkov light through the atmosphere is strongly influenced by the optical clarity of the atmosphere and the prevailing weather conditions. The performance of telescopes measuring this light is therefore dependent on atmospheric effects. This thesis presents software and hardware developed to implement a prototype sky monitoring system for use on the proposed next-generation gamma-ray telescope array, VERITAS. The system, consisting of a CCD camera and a far-infrared pyrometer, was successfully installed and tested on the ten metre atmospheric Cherenkov imaging telescope operated by the VERITAS Collaboration at the F.L. Whipple Observatory in Arizona. The thesis also presents the results of observations of the BL Lacertae object, 1ES1959+650, made with the Whipple ten metre telescope. The observations provide evidence for TeV gamma-ray emission from the BL Lacertae object, 1ES1959+650, at a level of more than 15 standard deviations above background. This represents the first unequivocal detection of this object at TeV energies, making it only the third extragalactic source seen at such levels of significance in this energy range. The flux variability of the source on a number of timescales is also investigated.

Design, development and testing of a CAD integrated design for environment software tool.

The research described in this thesis was developed as part o f the Information Management for Green Design (IMA GREE) Project. The 1MAGREE Project was founded by Enterprise Ireland under a Strategic Research Grant Scheme as a partnership project between Galway Mayo Institute o f Technology and C1MRU University College Galway. The project aimed to develop a CAD integrated software tool to support environmental information management for design, particularly for the electronics-manufacturing sector in Ireland.

Optimisation of a surface mount technology process using a SnAgCu lead-free alloy

The impending introduction of lead-free solder in the manufacture of electrical and electronic products has presented the electronics industry with many challenges. European manufacturers must transfer from a tin-lead process to a lead-free process by July 2006 as a result of the publication of two directives from the European Parliament. Tin-lead solders have been used for mechanical and electrical connections on printed circuit boards for over fifty years and considerable process knowledge has been accumulated. Extensive literature reviews were conducted on the topic and as a result it was found there are many implications to be considered with the introduction of lead-free solder. One particular question that requires answering is; can lead-free solder be used in existing manufacturing processes? The purpose of this research is to conduct a comparative study of a tin-lead solder and a lead-free solder in two key surface mount technology (SMT) processes. The two SMT processes in question were the stencil printing process and the reflow soldering process. Unreplicated fractional factorial experimental designs were used to carry out the studies. The quality of paste deposition in terms of height and volume were the characteristics of interest in the stencil printing process. The quality of solder joints produced in the reflow soldering experiment was assessed using x-ray and cross sectional analysis. This provided qualitative data that was then uniquely scored and weighted using a method developed during the research. Nested experimental design techniques were then used to analyse the resulting quantitative data. Predictive models were developed that allowed for the optimisation of both processes. Results from both experiments show that solder joints of comparable quality to those produced using tin-lead solder can be produced using lead-free solder in current SMT processes.