Design, development and testing of a CAD integrated design for environment software tool.

The research described in this thesis was developed as part o f the Information Management for Green Design (IMA GREE) Project. The 1MAGREE Project was founded by Enterprise Ireland under a Strategic Research Grant Scheme as a partnership project between Galway Mayo Institute o f Technology and C1MRU University College Galway. The project aimed to develop a CAD integrated software tool to support environmental information management for design, particularly for the electronics-manufacturing sector in Ireland.

Implementation of a customer relationship management system in an SME

The research conducted for this thesis has been carried out over a two year period as part of the Mobile Tools and Technology for customer care (MOTTO) project. The project was funded under the Applied Grant scheme administered by Enterprise Ireland and Nortel Networks Ltd. It was a partnership project between Galway-Mayo Institute of Technology, University of Limerick, National University of Ireland Galway, and a global Internet and communications company, Nortel Networks. The project aimed to investigate the enabling mobile communications technologies in e-Business and mobile communications in the area of Business-to-Business (B2B) customer care. The development of the application discussed in this thesis was developed in conjunction with the Galway-Mayo Institute of Technology, University of Limerick and AMT Ireland. The decision to develop the application in the Electronics Company of AMT in Limerick came about as a result of the contact established by Mark Southern from the University of Limerick. Mark was involved in overseeing the development and assisted in establishing the user requirements.

Optimisation of a surface mount technology process using a SnAgCu lead-free alloy

The impending introduction of lead-free solder in the manufacture of electrical and electronic products has presented the electronics industry with many challenges. European manufacturers must transfer from a tin-lead process to a lead-free process by July 2006 as a result of the publication of two directives from the European Parliament. Tin-lead solders have been used for mechanical and electrical connections on printed circuit boards for over fifty years and considerable process knowledge has been accumulated. Extensive literature reviews were conducted on the topic and as a result it was found there are many implications to be considered with the introduction of lead-free solder. One particular question that requires answering is; can lead-free solder be used in existing manufacturing processes? The purpose of this research is to conduct a comparative study of a tin-lead solder and a lead-free solder in two key surface mount technology (SMT) processes. The two SMT processes in question were the stencil printing process and the reflow soldering process. Unreplicated fractional factorial experimental designs were used to carry out the studies. The quality of paste deposition in terms of height and volume were the characteristics of interest in the stencil printing process. The quality of solder joints produced in the reflow soldering experiment was assessed using x-ray and cross sectional analysis. This provided qualitative data that was then uniquely scored and weighted using a method developed during the research. Nested experimental design techniques were then used to analyse the resulting quantitative data. Predictive models were developed that allowed for the optimisation of both processes. Results from both experiments show that solder joints of comparable quality to those produced using tin-lead solder can be produced using lead-free solder in current SMT processes.