Synthetic and mechanistic studies of the Thia-Fries Rearrangement

A study has been undertaken of the published literature on the Fries rearrangement, thermal, photo and microwave, since its discovery in 1908. A resume of these publications and especially of those pertaining to the thia-Fries rearrangement of sulfamate esters, has been compiled. Phenyl sulfamate, phenyl N,N-dimethylsulfamate, phenyl N,N-diethylsulfamate and phenyl N,N-di-n-propylsulfamate and many of their substituted compounds have been synthesised and purified, a total of thirty nine esters. The sulfamates have been characterised by mp / bp, infrared, C, H and N microanalysis and mass spectrum. Many of these sulfamates, twenty six in total, have been rearranged to sulfonamides in the thia-Fries rearrangement, and subsequently purified. The products were characterised by mp / bp, infrared, C, H and N microanalysis and mass spectrum. Mechanistic studies of the sulfamates have been investigated, particularly phenyl N,N-dimethylsulfamate. The rearrangement with various catalysts and catalytic ratios, the effect of solvents on the rearrangement and many crossover experiments have been carried out to determine the molecularity i.e. whether it is an inter-, intra- or bimolecular reaction. The microwave induced thia-Fries rearrangement has been examined to determine what effect this irradiation has on the rearrangement. Photo thia-Fries rearrangement has also been investigated.

Optimisation of a surface mount technology process using a SnAgCu lead-free alloy

The impending introduction of lead-free solder in the manufacture of electrical and electronic products has presented the electronics industry with many challenges. European manufacturers must transfer from a tin-lead process to a lead-free process by July 2006 as a result of the publication of two directives from the European Parliament. Tin-lead solders have been used for mechanical and electrical connections on printed circuit boards for over fifty years and considerable process knowledge has been accumulated. Extensive literature reviews were conducted on the topic and as a result it was found there are many implications to be considered with the introduction of lead-free solder. One particular question that requires answering is; can lead-free solder be used in existing manufacturing processes? The purpose of this research is to conduct a comparative study of a tin-lead solder and a lead-free solder in two key surface mount technology (SMT) processes. The two SMT processes in question were the stencil printing process and the reflow soldering process. Unreplicated fractional factorial experimental designs were used to carry out the studies. The quality of paste deposition in terms of height and volume were the characteristics of interest in the stencil printing process. The quality of solder joints produced in the reflow soldering experiment was assessed using x-ray and cross sectional analysis. This provided qualitative data that was then uniquely scored and weighted using a method developed during the research. Nested experimental design techniques were then used to analyse the resulting quantitative data. Predictive models were developed that allowed for the optimisation of both processes. Results from both experiments show that solder joints of comparable quality to those produced using tin-lead solder can be produced using lead-free solder in current SMT processes.