Management and evaluation of a range of forest species for use as cut foliage

This project explored the possibility of harvesting marketable foliage stems in addition to producing timber from plantations of Larix leptolepis, Cupressus macrocarpa ‘Goldcrest’ and Tsuga heterophylla. Data recorded from trial sites included both growth parameters, in the form of height and diameter increments, and production parameters in the form of foliage stem yields. Results varied with species and site type. In many cases, results achieved appear to have been influenced more by the biology of the trees than by the treatments alone. Trials were also established to investigate methods of managing old or over grown Abies procera Christmas tree plantations for forest foliage production. Shelf life testing and market research into the domestic trade of forest foliage were also conducted over the course of the project. Recommendations for managing forest plantations for foliage production as well as a general discussion on the industry are presented in this report.

Optimisation of a surface mount technology process using a SnAgCu lead-free alloy

The impending introduction of lead-free solder in the manufacture of electrical and electronic products has presented the electronics industry with many challenges. European manufacturers must transfer from a tin-lead process to a lead-free process by July 2006 as a result of the publication of two directives from the European Parliament. Tin-lead solders have been used for mechanical and electrical connections on printed circuit boards for over fifty years and considerable process knowledge has been accumulated. Extensive literature reviews were conducted on the topic and as a result it was found there are many implications to be considered with the introduction of lead-free solder. One particular question that requires answering is; can lead-free solder be used in existing manufacturing processes? The purpose of this research is to conduct a comparative study of a tin-lead solder and a lead-free solder in two key surface mount technology (SMT) processes. The two SMT processes in question were the stencil printing process and the reflow soldering process. Unreplicated fractional factorial experimental designs were used to carry out the studies. The quality of paste deposition in terms of height and volume were the characteristics of interest in the stencil printing process. The quality of solder joints produced in the reflow soldering experiment was assessed using x-ray and cross sectional analysis. This provided qualitative data that was then uniquely scored and weighted using a method developed during the research. Nested experimental design techniques were then used to analyse the resulting quantitative data. Predictive models were developed that allowed for the optimisation of both processes. Results from both experiments show that solder joints of comparable quality to those produced using tin-lead solder can be produced using lead-free solder in current SMT processes.