Cu2ZnSnS4 absorber layers obtained through sulphurization of metallic precursors: Graphite box versus sulphur flux

In this work we employed a hybrid method, combining RF-magnetron sputtering with evaporation, for the deposition of tailor made metallic precursors, with varying number of Zn/Sn/Cu (ZTC) periods and compared two approaches to sulphurization. Two series of samples with 1×, 2× and 4× ZTC periods have been prepared. One series of precursors was sulphurized in a tubular furnace directly exposed to a sulphur vapour and N2+5% H2 flux at a pressure of 5.0×10+4 Pa. A second series of identical precursors was sulphurized in the same furnace but inside a graphite box where sulphur pellets have been evaporated again in the presence of N2+5% H2 and at the same pressure as for the sulphur flux experiments. The morphological and chemical analyses revealed a small grain structure but good average composition for all three films sulphurized in the graphite box. As for the three films sulphurized in sulphur flux grain growth was seen with the increase of the number of ZTC periods whilst, in terms of composition, they were slightly Zn poor. The films' crystal structure showed that Cu2ZnSnS4 is the dominant phase. However, in the case of the sulphur flux films SnS2 was also detected. Photoluminescence spectroscopy studies showed an asymmetric broad band emission whichoccurs in the range of 1–1.5 eV. Clearly the radiative recombination efficiency is higher in the series of samples sulphurized in sulphur flux. We have found that sulphurization in sulphur flux leads to better film morphology than when the process is carried out in a graphite box in similar thermodynamic conditions. Solar cells have been prepared and characterized showing a correlation between improved film morphology and cell performance. The best cells achieved an efficiency of 2.4%.

Multi-μ: an Ada 95 based architecture for fault tolerance support of real-time systems

This paper presents an architecture (Multi-μ) being implemented to study and develop software based fault tolerant mechanisms for Real-Time Systems, using the Ada language (Ada 95) and Commercial Off-The-Shelf (COTS) components. Several issues regarding fault tolerance are presented and mechanisms to achieve fault tolerance by software active replication in Ada 95 are discussed. The Multi-μ architecture, based on a specifically proposed Fault Tolerance Manager (FTManager), is then described. Finally, some considerations are made about the work being done and essential future developments.

Passive Fault-Tolerance Management in Component-based Embedded Systems

It is imperative to accept that failures can and will occur, even in meticulously designed distributed systems, and design proper measures to counter those failures. Passive replication minimises resource consumption by only activating redundant replicas in case of failures, as typically providing and applying state updates is less resource demanding than requesting execution. However, most existing solutions for passive fault tolerance are usually designed and configured at design time, explicitly and statically identifying the most critical components and their number of replicas, lacking the needed flexibility to handle the runtime dynamics of distributed component-based embedded systems. This paper proposes a cost-effective adaptive fault tolerance solution with a significant lower overhead compared to a strict active redundancy-based approach, achieving a high error coverage with the minimum amount of redundancy. The activation of passive replicas is coordinated through a feedback-based coordination model that reduces the complexity of the needed interactions among components until a new collective global service solution is determined, improving the overall maintainability and robustness of the system.