Actuador linear para teste de teclas na indústria automóvel

As indústrias de componentes e acessórios automóveis são um elo fundamental no processo produtivo da indústria automóvel. Neste leque industrial encontra-se a Preh Portugal, Lda, como empresa fornecedora de componentes electrónicos, mais concretamente, painéis de controlo de climatização. Os painéis fornecidos pela Preh aos seus clientes encontram-se sujeitos a rigorosos testes de qualidade e funcionalidade. Neste sentido o teste funcional das teclas surge, relacionando o curso da tecla em função de uma força actuante. Esta relação está comprometida com uma curva característica padrão para o tipo de tecla. Para além destes compromissos, também é necessário que a tecla feche e abra o seu contacto eléctrico. Esta tese foca-se no desenvolvimento do teste de teclas, apresentando uma alteração ao sistema actual com a introdução de um sistema embebido, no intuito de flexibilizar o sistema de teste e reduzindo custos. O sistema embebido pretende dar capacidade de processamento ao teste e, desta forma, substituir o actual computador como elemento de processamento. A solução implementada consistiu numa mudança estrutural, através da inclusão do sistema embebido entre o computador e o sistema de deslocamento. Passando o foco central do processo de teste a residir no sistema embebido, este tem de estabelecer comunicações com os restantes elementos intervenientes no teste. Estabelece comunicações série RS-232 com o sistema de deslocamento (leitura do curso e força na tecla), Ethernet com o computador (comandos, parâmetros e resultados) e CAN com o painel de controlo de climatização (fecho/abertura do contacto eléctrico). A concretização deste projecto resultou numa nova estrutura e aplicação, a qual é facilmente integrada na linha de produção com as vantagens de ser menos onerosa e mais flexível, conforme o pretendido.

Trimethoprim-selective electrodes with molecularly imprinted polymers acting as ionophores and potentiometric transduction on graphite solid-contact

This work proposes a new biomimetic sensor material for trimethoprim. It is prepared by means of radical polymerization, having trimethylolpropane trimethacrylate as cross-linker, benzoyl peroxide as radicalar iniciator, chloroform as porogenic solvent, and methacrylic acid and 2-vinyl pyridine as monomers. Different percentages of sensor in a range between 1 and 6% were studied. Their behavior was compared to that obtained with ion-exchanger quaternary ammonium salt (additive tetrakis(p-chlorophenyl)borate or tetraphenylborate). The effect of an anionic additive in the sensing membrane was also tested. Trimethoprim sensors with 1% of imprinted particles from methacrylic acid monomers showed the best response in terms of slope (59.7 mV/decade) and detection limit (4.01×10−7 mol/L). These electrodes displayed also a good selectivity towards nickel, manganese aluminium, ammonium, lead, potassium, sodium, iron, chromium, sulfadiazine, alanine, cysteine, tryptophan, valine and glycine. The sensors were not affected by pH changes from 2 to 6. They were successfully applied to the analysis of water from aquaculture.

Tensile behaviour of a structural adhesive at high temperatures by the extended finite element method

Component joining is typically performed by welding, fastening, or adhesive-bonding. For bonded aerospace applications, adhesives must withstand high-temperatures (200°C or above, depending on the application), which implies their mechanical characterization under identical conditions. The extended finite element method (XFEM) is an enhancement of the finite element method (FEM) that can be used for the strength prediction of bonded structures. This work proposes and validates damage laws for a thin layer of an epoxy adhesive at room temperature (RT), 100, 150, and 200°C using the XFEM. The fracture toughness (G Ic ) and maximum load ( ); in pure tensile loading were defined by testing double-cantilever beam (DCB) and bulk tensile specimens, respectively, which permitted building the damage laws for each temperature. The bulk test results revealed that decreased gradually with the temperature. On the other hand, the value of G Ic of the adhesive, extracted from the DCB data, was shown to be relatively insensitive to temperature up to the glass transition temperature (T g ), while above T g (at 200°C) a great reduction took place. The output of the DCB numerical simulations for the various temperatures showed a good agreement with the experimental results, which validated the obtained data for strength prediction of bonded joints in tension. By the obtained results, the XFEM proved to be an alternative for the accurate strength prediction of bonded structures.

Replication management in reliable real-time systems

Building reliable real-time applications on top of commercial off-the-shelf (COTS) components is not a straightforward task. Thus, it is essential to provide a simple and transparent programming model, in order to abstract programmers from the low-level implementation details of distribution and replication. However, the recent trend for incorporating pre-emptive multitasking applications in reliable real-time systems inherently increases its complexity. It is therefore important to provide a transparent programming model, enabling pre-emptive multitasking applications to be implemented without resorting to simultaneously dealing with both system requirements and distribution and replication issues. The distributed embedded architecture using COTS components (DEAR-COTS) architecture has been previously proposed as an architecture to support real-time and reliable distributed computer-controlled systems (DCCS) using COTS components. Within the DEAR-COTS architecture, the hard real-time subsystem provides a framework for the development of reliable real-time applications, which are the core of DCCS applications. This paper presents the proposed framework, and demonstrates how it can be used to support the transparent replication of software components.

Towards a flexible and dynamic replication control for distributed real-time embedded systems with QoS interdependencies

Replication is a proven concept for increasing the availability of distributed systems. However, actively replicating every software component in distributed embedded systems may not be a feasible approach. Not only the available resources are often limited, but also the imposed overhead could significantly degrade the system's performance. The paper proposes heuristics to dynamically determine which components to replicate based on their significance to the system as a whole, its consequent number of passive replicas, and where to place those replicas in the network. The results show that the proposed heuristics achieve a reasonably higher system's availability than static offline decisions when lower replication ratios are imposed due to resource or cost limitations. The paper introduces a novel approach to coordinate the activation of passive replicas in interdependent distributed environments. The proposed distributed coordination model reduces the complexity of the needed interactions among nodes and is faster to converge to a globally acceptable solution than a traditional centralised approach.

Flexible and dynamic replication control for interdependent distributed real-time embedded systems

Replication is a proven concept for increasing the availability of distributed systems. However, actively replicating every software component in distributed embedded systems may not be a feasible approach. Not only the available resources are often limited, but also the imposed overhead could significantly degrade the system’s performance. This paper proposes heuristics to dynamically determine which components to replicate based on their significance to the system as a whole, its consequent number of passive replicas, and where to place those replicas in the network. The activation of passive replicas is coordinated through a fast convergence protocol that reduces the complexity of the needed interactions among nodes until a new collective global service solution is determined.

Feasibility of the extended finite element method for the simulation of composite bonded joints

Adhesive-bonding for the unions in multi-component structures is gaining momentum over welding, riveting and fastening. It is vital for the design of bonded structures the availability of accurate damage models, to minimize design costs and time to market. Cohesive Zone Models (CZM’s) have been used for fracture prediction in structures. The eXtended Finite Element Method (XFEM) is a recent improvement of the Finite Element Method (FEM) that relies on traction-separation laws similar to those of CZM’s but it allows the growth of discontinuities within bulk solids along an arbitrary path, by enriching degrees of freedom. This work proposes and validates a damage law to model crack propagation in a thin layer of a structural epoxy adhesive using the XFEM. The fracture toughness in pure mode I (GIc) and tensile cohesive strength (sn0) were defined by Double-Cantilever Beam (DCB) and bulk tensile tests, respectively, which permitted to build the damage law. The XFEM simulations of the DCB tests accurately matched the experimental load-displacement (P-d) curves, which validated the analysis procedure.

Replication in distributed systems using IEC 61499 standard

The international Electrotechnical Commission (IEC) 61499 architecture incorporated several function block with which distributed control application may be developed, and how these are interpreted and executed. However, due the distributed nature of the control applications, many issues also need to be taken into account. Most of these are due to the new error model and failure modes of the distributed hardware on which the distributed application is executed and also due the incomplete standards definition of the execution models. IEC 61499 frameworks does not clarify how to handle with replication of software and hardware components. In this paper we propose a replication model for IEC 61499 applications and which mechanisms and protocols may be used for their support.

Strength prediction of single- and double-lap joints by standard and extended finite element modelling

The structural integrity of multi-component structures is usually determined by the strength and durability of their unions. Adhesive bonding is often chosen over welding, riveting and bolting, due to the reduction of stress concentrations, reduced weight penalty and easy manufacturing, amongst other issues. In the past decades, the Finite Element Method (FEM) has been used for the simulation and strength prediction of bonded structures, by strength of materials or fracture mechanics-based criteria. Cohesive-zone models (CZMs) have already proved to be an effective tool in modelling damage growth, surpassing a few limitations of the aforementioned techniques. Despite this fact, they still suffer from the restriction of damage growth only at predefined growth paths. The eXtended Finite Element Method (XFEM) is a recent improvement of the FEM, developed to allow the growth of discontinuities within bulk solids along an arbitrary path, by enriching degrees of freedom with special displacement functions, thus overcoming the main restriction of CZMs. These two techniques were tested to simulate adhesively bonded single- and double-lap joints. The comparative evaluation of the two methods showed their capabilities and/or limitations for this specific purpose.

Finite Element Analysis (FEA) applied to heat transfer optimization process of pultrusion die systems

The aim of this study is to optimize the heat flow through the pultrusion die assembly system on the manufacturing process of a specific glass-fiber reinforced polymer (GFRP) pultrusion profile. The control of heat flow and its distribution through whole die assembly system is of vital importance in optimizing the actual GFRP pultrusion process. Through mathematical modeling of heating-die process, by means of Finite Element Analysis (FEA) program, an optimum heater selection, die position and temperature control was achieved. The thermal environment within the die was critically modeled relative not only to the applied heat sources, but also to the conductive and convective losses, as well as the thermal contribution arising from the exothermic reaction of resin matrix as it cures or polymerizes from the liquid to solid condition. Numerical simulation was validated with basis on thermographic measurements carried out on key points along the die during pultrusion process.

Optimizing the embedded heaters position in the pultrusion process using finite element analysis

This study is based on a previous experimental work in which embedded cylindrical heaters were applied to a pultrusion machine die, and resultant energetic performance compared with that achieved with the former heating system based on planar resistances. The previous work allowed to conclude that the use of embedded resistances enhances significantly the energetic performance of pultrusion process, leading to 57% decrease of energy consumption. However, the aforementioned study was developed with basis on an existing pultrusion die, which only allowed a single relative position for the heaters. In the present work, new relative positions for the heaters were investigated in order to optimize heat distribution process and energy consumption. Finite Elements Analysis was applied as an efficient tool to identify the best relative position of the heaters into the die, taking into account the usual parameters involved in the process and the control system already tested in the previous study. The analysis was firstly developed with basis on eight cylindrical heaters located in four different location plans. In a second phase, in order to refine the results, a new approach was adopted using sixteen heaters with the same total power. Final results allow to conclude that the correct positioning of the heaters can contribute to about 10% of energy consumption reduction, decreasing the production costs and leading to a better eco-efficiency of pultrusion process.

The use of the boundary element method in the analysis of single lap joints

The most common techniques for stress analysis/strength prediction of adhesive joints involve analytical or numerical methods such as the Finite Element Method (FEM). However, the Boundary Element Method (BEM) is an alternative numerical technique that has been successfully applied for the solution of a wide variety of engineering problems. This work evaluates the applicability of the boundary elem ent code BEASY as a design tool to analyze adhesive joints. The linearity of peak shear and peel stresses with the applied displacement is studied and compared between BEASY and the analytical model of Frostig et al., considering a bonded single-lap joint under tensile loading. The BEM results are also compared with FEM in terms of stress distributions. To evaluate the mesh convergence of BEASY, the influence of the mesh refinement on peak shear and peel stress distributions is assessed. Joint stress predictions are carried out numerically in BEASY and ABAQUS®, and analytically by the models of Volkersen, Goland, and Reissner and Frostig et al. The failure loads for each model are compared with experimental results. The preparation, processing, and mesh creation times are compared for all models. BEASY results presented a good agreement with the conventional methods.

Numerical and Experimental Analysis of Balanced and Unbalanced Adhesive Single-Lap Joints between Aluminium Adherends

The single-lap joint is the most commonly used, although it endures significant bending due to the non-collinear load path, which negatively affects its load bearing capabilities. The use of material or geometric changes is widely documented in the literature to reduce this handicap, acting by reduction of peel and shear peak stresses or alterations of the failure mechanism emerging from local modifications. In this work, the effect of using different thickness adherends on the tensile strength of single-lap joints, bonded with a ductile and brittle adhesive, was numerically and experimentally evaluated. The joints were tested under tension for different combinations of adherend thickness. The effect of the adherends thickness mismatch on the stress distributions was also investigated by Finite Elements (FE), which explained the experimental results and the strength prediction of the joints. The numerical study was made by FE and Cohesive Zone Modelling (CZM), which allowed characterizing the entire fracture process. For this purpose, a FE analysis was performed in ABAQUS® considering geometric non-linearities. In the end, a detailed comparative evaluation of unbalanced joints, commonly used in engineering applications, is presented to give an understanding on how modifications in the bonded structures thickness can influence the joint performance.

Replication vs erasure coding in data centric storage for wireless sensor networks

In-network storage of data in wireless sensor networks contributes to reduce the communications inside the network and to favor data aggregation. In this paper, we consider the use of n out of m codes and data dispersal in combination to in-network storage. In particular, we provide an abstract model of in-network storage to show how n out of m codes can be used, and we discuss how this can be achieved in five cases of study. We also define a model aimed at evaluating the probability of correct data encoding and decoding, we exploit this model and simulations to show how, in the cases of study, the parameters of the n out of m codes and the network should be configured in order to achieve correct data coding and decoding with high probability.

Sol-Gel Chemistry in Biosensing Devices of Electrical Transduction: Application to CEA Cancer Biomarker

Sol-gel chemistry allows the immobilization of organic molecules of biological origin on suibtable solid supports, permitting their integration into biosensing devices widening the possibility of local applications. The present work is an application of this principle, where the link between electrical receptor platform and the antibody acting as biorecognition element is made by sol-gel chemistry. The immunosensor design was targeted for carcinoembryonic antigen (CEA), an important biomarker for screening the colorectal cancer, by electrochemical techniques, namely electrochemical impedance spectroscopy (EIS) and square wave voltammetry (SVW). The device displayed linear behavior to CEA in EIS and in SWV assays ranging from 0.50 to 1.5ng/mL, and 0.25 to 1.5ng/mL, respectively. The corresponding detection limits were 0.42 and 0.043 ng/mL. Raman spectroscopy was used to characterize the surface modifications on the conductive platform (FTO glass). Overall, simple sol-gel chemistry was effective at the biosensing design and the presented approach can be a potential method for screening CEA in point-of-care, due to the simplicity of fabrication, short response time and low cost. - See more at: http://www.eurekaselect.com/127192/article#sthash.m1AWhINx.dpuf