A novel flow cytometric protocol for assessment of yeast cell adhesion

Microbial adhesion is a field of recognized relevance and, as such, an impressive array of tools has been developed to understand its molecular mechanisms and ultimately for its quantification. Some of the major limitations found within these methodologies concern the incubation time, the small number of cells analyzed, and the operator's subjectivity. To overcome these aspects, we have developed a quantitative method to measure yeast cells' adhesion through flow cytometry. In this methodology, a suspension of yeast cells is mixed with green fluorescent polystyrene microspheres (uncoated or coated with host proteins). Within 2 h, an adhesion profile is obtained based on two parameters: percentage and cells-microsphere population's distribution pattern. This flow cytometry protocol represents a useful tool to quantify yeast adhesion to different substrata in a large scale, providing manifold data in a speedy and informative manner.

Análise de ciclo de vida de duas soluções de ETICS

Dissertação de natureza científica para obtenção do grau de mestre em Engenharia Civil

Novos compostos orgânicos reticuláveis para aplicações em células fotovoltaicas

Trabalho Final de Mestrado para obtenção do grau de mestre em Engenharia Química e Biológica

Solution-Processable Donor-Acceptor-Donor Oligomers with Cross-Linkable Functionality

Electron-acceptor units, combined with bithiophene substituted with flexible chains end-functionalized with cross-linkable moieties, provide soluble donor-acceptor-donor (DAD) it-conjugated oligomer-type molecules with cross-linking ability and broad absorption in the visible spectrum. A study on the cross-linking conditions of the new oligomers to yield insoluble polymer networks is presented, including conditions for obtaining polymer films over poly(3,4-ethylenedioxythiophene):polystyrene sulfonate-covered substrates. The combination of the DAD molecular design and cross-linking functionality opens prospects for applications in solution-processed small-molecule solar cells with morphologically-stable organic layers.

Effect of explosive mixture on quality of explosive welds of copper to aluminium

The aim of this research is to investigate the influence of explosive ratio and type of sensitizer on the quality of explosive welds between copper and aluminium alloy plates. The welds were performed on a partially overlapping joint configuration using an emulsion explosive (EE) with two different sensitizers, hollow glass microspheres (HGMS) and expanded polystyrene spheres (EPS). Welds with an improved surface were achieved by using the HGMS sensitizer. A higher wave amplitude was registered in welds produced with the EPS sensitizer. In turn, the dimension of the molten pockets was influenced by the explosive ratio, increasing in size with increases in the values of this parameter. The intermetallic content of these zones varied according to the sensitizer type. Unlike the CuAl2 phase, the Cu-richer phases CuAl and Cu9Al4 were only identified in welds performed using the EPS sensitizer. An increase in hardness was observed at the interface of all welds, which resulted from both the presence of intermetallic phases and the plastic deformation of the materials promoted by the impact. This effect was most evident on the aluminium alloy side. All the welds had a greater strength than copper, i.e. the weakest material of the joint. (C) 2016 Elsevier Ltd. All rights reserved.