17 resultados para Three Dimensions IC (3D-IC)


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Co-deposition of nickel and cobalt was carried out on austenitic stainless steel (AISI 304) substrates by imposing a square waveform current in the cathodic region. The innovative procedure applied in this work allows creating a stable, fully developed, and open porous three-dimensional (3D) dendritic structure, which can be used as electrode for redox supercapacitors. This study investigates in detail the influence of the applied current density on the morphology, mass, and chemical composition of the deposited Ni-Co films and the resulting 3D porous network dendritic structure. The morphology and the physicochemical composition were studied by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS) and X-ray diffraction (W). The electrochemical behavior of the materials was evaluated by cyclic voltammetry (CV). The results highlight the mechanism involved in the coelectrodeposition process and how the lower limit current density tailors the film composition and morphology, as well as its electrochemical activity.

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In this work, plasticizer agents were incorporated in a chitosan based formulation, as a strategy to improve the fragile structure of chitosan based-materials. Three different plasticizers: ethylene glycol, glycerol and sorbitol, were blended with chitosan to prepare 3D dense chitosan specimens. The properties of the obtained structures were assessed for mechanical, microstructural, physical and biocompatibility behavior. The results obtained revealed that from the different specimens prepared, the blend of chitosan with glycerol has superior mechanical properties and good biological behavior, making this chitosan based formulation a good candidate to improve robust chitosan structures for the construction of bioabsorbable orthopedic implants.