Ion beam assisted deposition of an organic light emitting diode electrode

This work presents the electro-optical characterization of metal-organic interfaces prepared by the Ion Beam Assisted Deposition (IBAD) method. IBAD applied in this work combines simultaneously metallic film deposition and bombardment with an independently controlled ion beam, allowing different penetration of the ions and the evaporated metallic elements into the polymer. The result is a hybrid, non-abrupt interface, where polymer, metal and ion coexists. We used an organic light emitting diode, which has a typical vertical-architecture, for the interface characterization: Glass/Indium Tin Oxide (ITO)/Poly[ethylene-dioxythiophene/poly{styrenesulfonicacid}]) (PEDOT:PSS) /Emitting Polymer/Metal. The emitting polymer layer comprised of the Poly[(9,9-dioctyl-2,7-divinylenefluorenylene)-alt-co-{2-methoxy-5-(2-ethylhexyloxy)-1,4-phenylene}] (PFO) and the metal layer of aluminum prepared with different Ar(+) ion energies varying in the range from 0 to 1000 eV. Photoluminescence, Current-Voltage and Electroluminescence measurements were used to study the emission and electron injection properties. Changes of these properties were related with the damage caused by the energetic ions and the metal penetration into the polymer. Computer simulations of hybrid interface damage and metal penetration were confronted with experimental data. (C) 2010 Elsevier B.V. All rights reserved.

Organic additive-copper(II) complexes as plating precursors

Cu(II) ions previously coordinated with typical electroplating organic additives were investigated as an alternative source of metal for plating bath. The coordination complexes were isolated from reaction between CuSO(4) and organic additives as ligands (oxalate ion, ethylenediamine or imidazole). Deposits over 1010 steel were successfully obtained from electroplated baths using the complexes without any addition of free additives, at pH = 4.5 (H(2)SO(4)/Na(2)SO(4)). These deposits showed better morphologies than deposits obtained from CuSO(4) solution either in the absence or presence of oxalate ion as additive (40 mmol L(-1)), at pH = 4.5 (H(2)SO(4)/Na(2)SO(4))It is suggestive that the starting metal plating coordinated with additives influences the electrode position processes, providing deposits with corrosion potentials shifted over + 200 mV in 0.5 mol L(-1) NaCl (1 mV s(-1)). The resistance against corrosion is sensitive to the type of additive-complex used as precursor. The complex with ethylenediamine presented the best deposit results with the lowest pitting potential (-0.27 V vs 3.0 mol L(-1) CE). It was concluded that the addition of free additives to the electrodeposition baths is not necessary when working with previously coordinated additives. Thus, the complexes generated in ex-situ are good alternatives as plating precursors for electrodeposition bath. (C) 2009 Elsevier B.V. All rights reserved.