Thermogravimetric study of the decomposition of printed circuit boards from mobile phones

Thermal decomposition of printed circuits boards (PCB) is studied, using thermogravimetric analysis to compare the thermal behavior of PCB of mobile phones before and after the removal of the metallic fraction by acid washing. Several dynamic and dynamic + isothermal runs have been carried out at different heating rates (5, 10 and 20 K min−1), from room temperature to more than 1100 K. Also runs in the presence and in the absence of oxygen were performed (combustion and pyrolysis runs). Moreover, TG–MS experiments were performed (both in inert and oxidizing atmosphere) in order to better understand the thermal decomposition of these wastes and identify some compounds emitted during the controlled heating of these materials. Different reaction models are proposed, one for pyrolysis and one for combustion of the two kinds of wastes studied, which proved to simulate appropriately the experimental results at all the heating rates simultaneously.

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO2005-TEQ/kg sample, corresponding to the sample with and without metals, respectively.

Effect of Temperature, Atmosphere and Metals on the Thermal Degradation of Printed Circuit Boards

The permanent expansion of the market of electrical and electronic equipment (EEE) and the shorter innovation cycles, lead to a faster replacement of these appliances, making EEE a fast-growing source of waste (WEEE). As stated in Directive 2012/19/EU1 on waste electrical and electronic equipment, the content of hazardous components in EEE is a major concern during the waste management phase, and recycling of WEEE is not currently undertaken to a sufficient extent, resulting in a loss of valuable resources.

Emissions of Gases, Polycyclic Aromatic Hydrocarbons and Brominated Pollutants during Thermal Degradation of Waste Printed Circuit Boards

Resumen del póster presentado en Symposium on Renewable Energy and Products from Biomass and Waste, CIUDEN (Cubillos de Sil, León, Spain), 12-13 May 2015

Kinetic Analysis and Pollutant Evolution During Thermal Degradation of Printed Circuit Boards Considering the Effect of Metals

Paper submitted to the 7th International Symposium on Feedstock Recycling of Polymeric Materials (7th ISFR 2013), New Delhi, India, 23-26 October 2013.

Thermogravimetric Study of the Decomposition of Printed Circuit Boards from Mobile Phones

Paper submitted to the 19th International Symposium on Analytical & Applied Pyrolysis, Linz, Austria, 21-25 May 2012.

Pollutant Formation During the Thermal Decomposition of Electrical and Electronic Wastes

Paper submitted to the 7th International Symposium on Feedstock Recycling of Polymeric Materials (7th ISFR 2013), New Delhi, India, 23-26 October 2013.