Kinetic Analysis and Pollutant Evolution During Thermal Degradation of Printed Circuit Boards Considering the Effect of Metals

Paper submitted to the 7th International Symposium on Feedstock Recycling of Polymeric Materials (7th ISFR 2013), New Delhi, India, 23-26 October 2013.

Effect of Temperature, Atmosphere and Metals on the Thermal Degradation of Printed Circuit Boards

The permanent expansion of the market of electrical and electronic equipment (EEE) and the shorter innovation cycles, lead to a faster replacement of these appliances, making EEE a fast-growing source of waste (WEEE). As stated in Directive 2012/19/EU1 on waste electrical and electronic equipment, the content of hazardous components in EEE is a major concern during the waste management phase, and recycling of WEEE is not currently undertaken to a sufficient extent, resulting in a loss of valuable resources.