Plastisol foaming process. Decomposition of the foaming agent, polymer behavior in the corresponding temperature range and resulting foam properties

The decomposition of azodicarbonamide, used as foaming agent in PVC—plasticizer (1/1) plastisols was studied by DSC. Nineteen different plasticizers, all belonging to the ester family, two being polymeric (polyadipates), were compared. The temperature of maximum decomposition rate (in anisothermal regime at 5 K min−1 scanning rate), ranges between 434 and 452 K. The heat of decomposition ranges between 8.7 and 12.5 J g−1. Some trends of variation of these parameters appear significant and are discussed in terms of solvent (matrix) and viscosity effects on the decomposition reactions. The shear modulus at 1 Hz frequency was determined at the temperature of maximum rate of foaming agent decomposition, and differs significantly from a sample to another. The foam density was determined at ambient temperature and the volume fraction of bubbles was used as criterion to judge the efficiency of the foaming process. The results reveal the existence of an optimal shear modulus of the order of 2 kPa that corresponds roughly to plasticizer molar masses of the order of 450 ± 50 g mol−1. Heavier plasticizers, especially polymeric ones are too difficult to deform. Lighter plasticizers such as diethyl phthalate (DEP) deform too easily and presumably facilitate bubble collapse.

Influence of the Temperature on the Liquid–Liquid–Solid Equilibria of the Water + Ethanol + 1-Undecanol Ternary System

Liquid–liquid (L–L), solid–liquid (S–L), and solid–liquid–liquid (S–L–L) equilibrium data for the water–ethanol–1-undecanol ternary system have been determined experimentally at (275.15, 278.15, 281.15, 288.15, and 298.15) K and atmospheric pressure. Different shapes of the equilibrium diagrams have been observed depending on the temperature. A region with three phases (S–L–L) is present in the temperature range between (275.15 and 281.15) K. Above 288.15 K, only a L–L region is observed.

Ferromagnetism mediated by few electrons in a semimagnetic quantum dot

A (II,Mn)VI diluted magnetic semiconductor quantum dot with an integer number of electrons controlled with a gate voltage is considered. We show that a single electron is able to induce a collective spontaneous magnetization of the Mn spins, overcoming the short range antiferromagnetic interactions, at a temperature order of 1 K, 2 orders of magnitude above the ordering temperature in bulk. The magnetic behavior of the dot depends dramatically on the parity of the number of electrons in the dot.

Liquid–Liquid Equilibria of Water + Ethanol + 1-Butyl-3-methylimidazolium Bis(trifluoromethanesulfonyl)imide Ternary System: Measurements and Correlation at Different Temperatures

In this work authors present the experimental liquid–liquid equilibria (LLE) data of water + ethanol + 1-butyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide ([bmim][Tf2N]) system at different temperatures. The LLE of the system was obtained in the temperature range from 283.2 to 323.2 K. The nonrandom two liquid (NRTL) and universal quasichemical (UNIQUAC) models were used to correlate ternary systems. The equilibrium compositions were successfully correlated by the interaction parameters from both models, however UNIQUAC gave a more accurate correlation. Finally, a study about the solvent capability of ionic liquid was made in order to evaluate the possibility of separating the mixture formed by ethanol and water using that ionic liquid.

Dynamic bonding of metallic nanocontacts: Insights from experiments and atomistic simulations

The conductance across an atomically narrow metallic contact can be measured by using scanning tunneling microscopy. In certain situations, a jump in the conductance is observed right at the point of contact between the tip and the surface, which is known as “jump to contact” (JC). Such behavior provides a way to explore, at a fundamental level, how bonding between metallic atoms occurs dynamically. This phenomenon depends not only on the type of metal but also on the geometry of the two electrodes. For example, while some authors always find JC when approaching two atomically sharp tips of Cu, others find that a smooth transition occurs when approaching a Cu tip to an adatom on a flat surface of Cu. In an attempt to show that all these results are consistent, we make use of atomistic simulations; in particular, classical molecular dynamics together with density functional theory transport calculations to explore a number of possible scenarios. Simulations are performed for two different materials: Cu and Au in a [100] crystal orientation and at a temperature of 4.2 K. These simulations allow us to study the contribution of short- and long-range interactions to the process of bonding between metallic atoms, as well as to compare directly with experimental measurements of conductance, giving a plausible explanation for the different experimental observations. Moreover, we show a correlation between the cohesive energy of the metal, its Young's modulus, and the frequency of occurrence of a jump to contact.