3 resultados para solder
em University of Queensland eSpace - Australia
Resumo:
A number of magnesium alloys show promise as engine block materials. However, a critical issue for the automotive industry is corrosion of the engine block by the coolant and this could limit the use of magnesium engine blocks. This work assesses the corrosion performance of conventional magnesium alloy AZ91D and a recently developed engine block magnesium alloy AM-SC1 in several commercial coolants. Immersion testing, hydrogen evolution measurement, galvanic current monitoring and the standard ASTM D1384 test were employed to reveal the corrosion performance of the magnesium alloys subjected to the coolants. The results show that the tested commercial coolants are corrosive to the magnesium alloys in terms of general and galvanic corrosion. The two magnesium alloys exhibited slightly different corrosion resistance to the coolants with AZ91D being more corrosion resistant than AM-SC1. The corrosivity varied from coolant to coolant. Generally speaking. an oraganic-acid based long life coolant was less corrosive to the magnesium alloys than a traditional coolant. Among the studied commercial coolants. Toyota long, life coolant appeared to be the most promising one. In addition. it was found that potassium fluoride effectively inhibited corrosion of the magnesium alloys in the studied commercial coolants. Both general and galvanic corrosion rates were significantly decreased by addition of KF, and there were no evident side effects on the other engine block materials, such as copper, solder. brass. steel and aluminium alloys, in terms of their corrosion performance. The ASTM D 1384 test further confirmed these results and suggested that Toyota long life coolant with 1%wt KF addition is a promising coolant for magnesium engine blocks.
Resumo:
Soldering alloys based oft the Sn-Cu alloy system are amongst the most favourable lead-free alternatives due to a range of attractive properties. Trace additions of Ni have been found to significantly improve the soldering characteristics of these alloys (reduced bridging etc.). This paper examines the mechanisms underlying the improvement in soldering properties of Sn-0.7 mass%Cu eutectic alloys modified with concentrations of Ni ranging front 0 to 1000 ppm. The alloys were investigated by thermal analysis during solidification, as well as optical/SEM microanalyses of fully solidified samples anti samples quenched during solidification. It is concluded that Ni additions dramatically alter the nucleation patterns and solidification behaviour of the Sn-Cu6Sn5 eutectic anti that these changes are related to the superior soldering characteristics of the Ni-modified Sn-0.7 mass%Cu alloys.
A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu
Resumo:
The influence of trace level Ni additions on the eutectic solidification mode of Sn-0.7Cu has been studied using continuous torque experiments during solidification. The solid fraction at which resistance to paddle rotation at the thermal centre of the sample occurs is related to the spatial distribution of solid during solidification. The results indicate that a transition in solidification mode occurs in the range 0-300 ppm Ni. Growth occurs antiparallel to heat flow from near the mould walls in the Ni-free alloy, while equiaxed growth from distributed centres dominates in alloys containing at least 300 ppm Ni. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.