2 resultados para REACTION LAYER
em University of Queensland eSpace - Australia
Resumo:
Soldering reactions are commonly observed during high pressure die casting of aluminium alloys, and involve the formation and growth of interfacial intermetallics between the die and the cast alloy. It is generally believed that close to 1% Fe is necessary in the aluminium alloy to reduce soldering. However, the role of iron in the interfacial reaction has not been studied in detail. In this investigation, reaction couples were formed between H13 tool steel substrates and an Al-11Si-2.5Cu melt containing either 0.15 or 0.60% Fe. Examination revealed distinctly different intermetallic layer morphology. The overall growth and chemistry of the reaction layer and the reaction rate measured by the consumption of the substrate were compared for the two alloy melts. It was demonstrated that a higher iron content reduces the rate of interfacial reaction, consistent with an observed thicker compact ( solid) intermetallic layer. Hence, the difference in reaction rate can be explained by a significant reduction in the diffusion flux due to a thicker compact layer. Finally, the mechanism of the growth of a thicker compact layer in the higher iron melt is proposed, based on the phase relations and diffusion both within and near the interfacial reaction zone. (C) 2004 Kluwer Academic Publishers.
Resumo:
Cu-based bulk metallic glass (BMG) composites containing in situ TiB particles were successfully fabricated. The reinforcing TiB particles with a size of 5-10 mu m are uniformly distributed in the amorphous matrix. The particles have a good bonding to the matrix with a reaction layer. The BMG composites exhibit an obvious ductility with a plastic strain of 2% for the 17.5 vol.% TiB sample due to the suppression of shear band propagation and the generation of multiple shear bands during compressive testing. The hardness of the materials is increased from Hv543 for monolithic BMG to Hv650 for 23.6 vol.% TiB-containing BMG composite. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.