A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu

The influence of trace level Ni additions on the eutectic solidification mode of Sn-0.7Cu has been studied using continuous torque experiments during solidification. The solid fraction at which resistance to paddle rotation at the thermal centre of the sample occurs is related to the spatial distribution of solid during solidification. The results indicate that a transition in solidification mode occurs in the range 0-300 ppm Ni. Growth occurs antiparallel to heat flow from near the mould walls in the Ni-free alloy, while equiaxed growth from distributed centres dominates in alloys containing at least 300 ppm Ni. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Transmission electron microscopy sample preparation technique for sintered alloys

Powder metallurgy alloys are typically inhomogeneous with a significant amount of porosity. This complicates conventional transmission electron microscopy sample preparation. However, the use of focused ion beam milling allows site specific transmission electron microscopy samples to be prepared in a short amount of time. This paper presents a method that can be used to produce transmission electron microscopy samples from an Al-Cu-Mg PM alloy. (C) 2003 IoM Communications Ltd. Published by Maney for the Institute of Materials, Minerals and Mining.

Electrochemical corrosion of unalloyed copper in chloride media–a critical review

The literature dealing with the electrochemical corrosion characteristics of unalloyed copper in aqueous chloride media is examined. The enormous quantity of polarisation and mixed/corrosion potential data that has been made available in the literature over the last 50 years has been compiled and discussed in a comprehensive review. For a wide range of electrode geometries, the importance of the chloride ion and the mass transport of anodic corrosion products on the corrosion behaviour of copper are made clear for both freshly polished and 'filmed' surfaces. (C) 2003 Elsevier Ltd. All rights reserved.

Synthesis and mechanical properties of Cu-based bulk metallic glass composites containing in-situ TiC particles

Cu-based bulk metallic glass matrix composites (BMGMCs) containing in-situ TiC particles were fabricated successfully. The yield and fracture strength increased from 1930 MPa, 2250 MPa to 2210 MPa, 2500 MPa, respectively. The ductility was improved and the hardness was also enhanced by 25%. The fracture mechanism was investigated in detail. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

In situ TiB-reinforced Cu-based bulk metallic glass composites

Cu-based bulk metallic glass (BMG) composites containing in situ TiB particles were successfully fabricated. The reinforcing TiB particles with a size of 5-10 mu m are uniformly distributed in the amorphous matrix. The particles have a good bonding to the matrix with a reaction layer. The BMG composites exhibit an obvious ductility with a plastic strain of 2% for the 17.5 vol.% TiB sample due to the suppression of shear band propagation and the generation of multiple shear bands during compressive testing. The hardness of the materials is increased from Hv543 for monolithic BMG to Hv650 for 23.6 vol.% TiB-containing BMG composite. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.