2 resultados para mark-recapture method
Resumo:
The aim of this study was to develop a multiplex loop-mediated isothermal amplification (LAMP) method capable of detecting Escherichia coli generally and verocytotoxigenic E. coli (VTEC) specifically in beef and bovine faeces. The LAMP assay developed was highly specific (100%) and able to distinguish between E. coli and VTEC based on the amplification of the phoA, and stx1 and/or stx2 genes, respectively. In the absence of an enrichment step, the limit of detection 50% (LOD50) of the LAMP assay was determined to be 2.83, 3.17 and 2.83-3.17 log CFU/g for E. coli with phoA, stx1 and stx2 genes, respectively, when artificially inoculated minced beef and bovine faeces were tested. The LAMP calibration curves generated with pure cultures, and spiked beef and faeces, suggested that the assay had good quantification capability. Validation of the assay, performed using retail beef and bovine faeces samples, demonstrated good correlation between counts obtained by the LAMP assay and by a conventional culture method, but suggested the possibility of false negative LAMP results for 12.5-14.7% of samples tested. The multiplex LAMP assay developed potentially represents a rapid alternative to culture for monitoring E.coli levels in beef or faeces and it would provide additional information on the presence of VTEC. However, some further optimisation is needed to improve detection sensitivity.
Resumo:
The machining of carbon fiber reinforced polymer (CFRP) composite presents a significant challenge to the industry, and a better understanding of machining mechanism is the essential fundament to enhance the machining quality. In this study, a new energy based analytical method was developed to predict the cutting forces in orthogonal machining of unidirectional CFRP with fiber orientations ranging from 0° to 75°. The subsurface damage in cutting was also considered. Thus, the total specific energy for cutting has been estimated along with the energy consumed for forming new surfaces, friction, fracture in chip formation and subsurface debonding. Experiments were conducted to verify the validity of the proposed model.