Self-healing of cracks during ductile regime machining of silicon: Insights from molecular dynamics simulation

During nanoindentation and ductile-regime machining of silicon, a phenomenon known as “self-healing” takes place in that the microcracks, microfractures, and small spallings generated during the machining are filled by the plastically flowing ductile phase of silicon. However, this phenomenon has not been observed in simulation studies. In this work, using a long-range potential function, molecular dynamics simulation was used to provide an improved explanation of this mechanism. A unique phenomenon of brittle cracking was discovered, typically inclined at an angle of 45° to 55° to the cut surface, leading to the formation of periodic arrays of nanogrooves being filled by plastically flowing silicon during cutting. This observation is supported by the direct imaging. The simulated X-ray diffraction analysis proves that in contrast to experiments, Si-I to Si-II (beta tin) transformation during ductile-regime cutting is highly unlikely and solid-state amorphisation of silicon caused solely by the machining stress rather than the cutting temperature is the key to its brittle-ductile transition observed during the MD simulations

Challenges and Opportunities in Edge Computing

Many cloud-based applications employ a data centre as a central server to process data that is generated by edge devices, such as smartphones, tablets and wearables. This model places ever increasing demands on communication and computational infrastructure with inevitable adverse effect on Quality-of-Service and Experience. The concept of Edge Computing is predicated on moving some of this computational load towards the edge of the network to harness computational capabilities that are currently untapped in edge nodes, such as base stations, routers and switches. This position paper considers the challenges and opportunities that arise out of this new direction in the computing landscape.